HiSilicon Kirin 955 vs Qualcomm Snapdragon 855 Plus

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 955 or HiSilicon Kirin 955 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 955 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
The Qualcomm Snapdragon 855 Plus features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q4/2018 and belongs to the 6 generation of the Qualcomm Snapdragon series.
HiSilicon Kirin 950 Group Qualcomm Snapdragon 855/860
4 Generation 6
HiSilicon Kirin 955 Name Qualcomm Snapdragon 855 Plus
Mobile Segment Mobile
HiSilicon Kirin Family Qualcomm Snapdragon
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 955 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.5 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Qualcomm Snapdragon 855 Plus has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.96 GHz.
1.8 GHz B-Core Frequency 2.42 GHz
hybrid (big.LITTLE) Core architecture hybrid (Prime / big.LITTLE)
4x Cortex-A72 Cores A 1x Kryo 485 Prime
8 CPU Cores 8
No Overclocking No
None None 4x Kryo 485 Silver
None None 1.8 GHz
No Hyperthreading No
2.5 GHz A-Core Frequency 2.96 GHz
4x Cortex-A53 Cores B 3x Kryo 485 Gold
8 Threads 8
 
 

Internal Graphics

The HiSilicon Kirin 955 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 955 uses the ARM Mali-T880 MP4, which has 64 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Qualcomm Snapdragon 855 Plus has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 855 Plus uses the Qualcomm Adreno 640, which has 384 texture shaders
0.9 GHz GPU (Turbo) 0.68 GHz
16 nm Technology 7 nm
11 Direct X 12.0
0 bytes Max. GPU Memory 4.0 GB
4 Execution units 4
Q2/2016 Release date Q1/2019
ARM Mali-T880 MP4 GPU name Qualcomm Adreno 640
64 Shaders 384
0.9 GHz GPU frequency 0.25 GHz
Midgard 4 Generation 5
-- Max. displays --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode h265 / HEVC (8 bit) Decode / Encode
No VP9 Decode / Encode
Decode / Encode VP8 Decode / Encode
No VC-1 No
Decode / Encode JPEG No
Decode / Encode h264 Decode / Encode
Decode h265 / HEVC (10 bit) Decode / Encode
No AVC No
No AV1 No
 
 

Memory & PCIe

LPDDR3, LPDDR4 Memory type LPDDR4X-4266
-- Bandwidth --
No AES-NI No
No ECC No
pci PCIe pci
0 bytes Max. Memory 16.0 GB
2 Memory channels 4
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

The HiSilicon Kirin 955 is manufactured using a 16 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Qualcomm Snapdragon 855 Plus is manufactured using a 7 nm process.
In total, this processor boasts a generous 3.0 MB cache.
None Virtualization None
16 nm Technology 7 nm
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
ISA extensions
-- Part Number SM8150-AC / SM8150P
Chiplet Chip design Chiplet
Q2/2016 Release date Q4/2018
-- Release price --
0 bytes L2-Cache 2.0 MB
Technical data sheet Documents Technical data sheet
0 bytes L3-Cache 3.0 MB
Socket
Android Operating systems Android
Cortex-A72 / Cortex-A53 Architecture Kryo 485