CPU comparison with benchmarks |
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CPU lineage |
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MediaTek Dimensity 8200 or MediaTek Dimensity 8200 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The MediaTek Dimensity 8200 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q4/2022 and belongs to the 3 generation of the Mediatek Dimensity series. The Qualcomm Snapdragon 8 Gen 2 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q4/2022 and belongs to the 2 generation of the Qualcomm Snapdragon series. |
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| Mobile | Segment | Mobile |
| MediaTek Dimensity 8200 | Name | Qualcomm Snapdragon 8 Gen 2 |
| Mediatek Dimensity | Family | Qualcomm Snapdragon |
| 3 | Generation | 2 |
| MediaTek Dimensity 8000 4nm | Group | Qualcomm Snapdragon 8 Gen 2 |
CPU Cores and Base Frequency |
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The MediaTek Dimensity 8200 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 3.1 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices. The Qualcomm Snapdragon 8 Gen 2 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 3.2 GHz. |
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| 4x Cortex-A55 | Cores C | 3x Cortex-A510 |
| 2.0 GHz | C-Core Frequency | 2.0 GHz |
| 3.0 GHz | B-Core Frequency | 2.8 GHz |
| 3.1 GHz | A-Core Frequency | 3.2 GHz |
| 3x Cortex-A78 | Cores B | 4x Cortex-A715/A710 |
| 1x Cortex-A78 | Cores A | 1x Cortex-X3 |
| No | Overclocking | No |
| hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
| 8 | Threads | 8 |
| No | Hyperthreading | No |
| 8 | CPU Cores | 8 |
Internal Graphics |
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The MediaTek Dimensity 8200 has integrated graphics, called iGPU for short.
and 6 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. The Qualcomm Snapdragon 8 Gen 2 has integrated graphics, called iGPU for short. |
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| -- | GPU frequency | 0.68 GHz |
| Q2/2021 | Release date | Q4/2022 |
| 12 | Direct X | 12.1 |
| ARM Mali-G610 MP6 | GPU name | Qualcomm Adreno 740 |
| 4 nm | Technology | 4 nm |
| -- | Max. displays | -- |
| -- | Shaders | -- |
| 0 bytes | Max. GPU Memory | 12.0 GB |
| 6 | Execution units | -- |
| Vallhall 3 | Generation | 8 |
| -- | GPU (Turbo) | -- |
Artificial Intelligence and Machine Learning |
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| -- | AI specifications | -- |
| -- | AI hardware | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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| Decode / Encode | AVC | Decode |
| Decode / Encode | VC-1 | Decode |
| Decode / Encode | VP9 | Decode / Encode |
| Decode / Encode | h265 / HEVC (10 bit) | Decode / Encode |
| Decode / Encode | h264 | Decode / Encode |
| Decode / Encode | VP8 | Decode / Encode |
| Decode / Encode | h265 / HEVC (8 bit) | Decode / Encode |
| Decode / Encode | JPEG | Decode / Encode |
| Decode | AV1 | No |
Memory & PCIe |
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| 4 | Memory channels | 4 |
| 0 bytes | Max. Memory | 16.0 GB |
| pci | PCIe | pci |
| No | AES-NI | No |
| No | ECC | No |
| 51.2 GB/s | Bandwidth | -- |
| LPDDR5-6400 | Memory type | LPDDR5X-4200 |
Thermal Management |
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TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
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| -- | Tjunction max | -- |
Technical details |
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The MediaTek Dimensity 8200 is manufactured using a 4 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The Qualcomm Snapdragon 8 Gen 2 is manufactured using a 4 nm process. |
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| Q4/2022 | Release date | Q4/2022 |
| MT6896 / MT6896Z | Part Number | SM8550-AB |
| 0 bytes | L2-Cache | 0 bytes |
| None | Virtualization | None |
| ISA extensions | ||
| Chiplet | Chip design | Chiplet |
| Cortex-A78 / -A78 / -A55 | Architecture | Cortex-X3 / -A715 / -A510 |
| 4 nm | Technology | 4 nm |
| Socket | ||
| Android | Operating systems | Android, Windows 10/11 (ARM) |
| -- | Release price | -- |
| Technical data sheet | Documents | Technical data sheet |
| ARMv8-A64 (64 bit) | Instruction set (ISA) | ARMv9-A64 (64 bit) |
| 0 bytes | L3-Cache | 0 bytes |
AnTuTu 9 Benchmark
Geekbench 6 (Multi-Core)
Geekbench 5, 64bit (Multi-Core)
iGPU - FP32 Performance (Single-precision GFLOPS)
Geekbench 6 (Single-Core)
Geekbench 5, 64bit (Single-Core)
