Qualcomm Snapdragon 765G vs HiSilicon Kirin 820 5G

Qualcomm Snapdragon 765G or Qualcomm Snapdragon 765G – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 820 5G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2019 and belongs to the 6 generation of the HiSilicon Kirin series.

The HiSilicon Kirin 820 5G has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.36 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.

The Qualcomm Snapdragon 765G does not have integrated graphics.
The HiSilicon Kirin 820 5G has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 820 5G uses the ARM Mali-G57 MP6, which has 96 texture shaders
and 6 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 6 W watts.

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 820 5G is manufactured using a 7 nm process.
In total, this processor boasts a generous 2.0 MB cache.