Qualcomm Snapdragon 855 vs AMD Ryzen Embedded R2312

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 855 or Qualcomm Snapdragon 855 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 855 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q4/2018 and belongs to the 6 generation of the Qualcomm Snapdragon series.
The AMD Ryzen Embedded R2312 features 2 processor cores and has the capability to manage 4 threads concurrently.
It was released in Q2/2022 and belongs to the 2 generation of the AMD Ryzen Embedded R series.
To use the AMD Ryzen Embedded R2312, you'll need a motherboard with a FP5 socket.
Mobile Segment Desktop / Server
Qualcomm Snapdragon 855 Name AMD Ryzen Embedded R2312
Qualcomm Snapdragon Family AMD Ryzen Embedded R
6 Generation 2
Qualcomm Snapdragon 855/860 Group AMD Ryzen Embedded R2000
 
 

CPU Cores and Base Frequency

The Qualcomm Snapdragon 855 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.84 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The AMD Ryzen Embedded R2312 has 2 CPU cores and can calculate 4 threads in parallel.
The clock frequency of the AMD Ryzen Embedded R2312 is 2.7 GHz
and turbo frequency for one core is 3.5 GHz.
4x Kryo 485 Silver Cores C None
None None 3.5 GHz
1.8 GHz C-Core Frequency None
2.42 GHz B-Core Frequency None
2.84 GHz A-Core Frequency None
3x Kryo 485 Gold Cores B None
1x Kryo 485 Prime Cores A None
No Overclocking No
hybrid (Prime / big.LITTLE) Core architecture normal
None None 2.7 GHz
8 Threads 4
None None 3.1 GHz
No Hyperthreading Yes
8 CPU Cores 2
None None 4x
 
 

Internal Graphics

The Qualcomm Snapdragon 855 has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 855 uses the Qualcomm Adreno 640, which has 384 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The AMD Ryzen Embedded R2312 has integrated graphics, called iGPU for short.
Specifically, the AMD Ryzen Embedded R2312 uses the AMD Radeon Vega 3 Graphics, which has 192 texture shaders
and 3 execution units.
0.25 GHz GPU frequency 1.2 GHz
Q1/2019 Release date Q1/2018
12.0 Direct X 12
Qualcomm Adreno 640 GPU name AMD Radeon Vega 3 Graphics
7 nm Technology 14 nm
-- Max. displays --
384 Shaders 192
4.0 GB Max. GPU Memory 2.0 GB
4 Execution units 3
5 Generation 8
0.59 GHz GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
No AVC Decode / Encode
No VC-1 Decode
Decode / Encode VP9 Decode / Encode
Decode / Encode h265 / HEVC (10 bit) Decode / Encode
Decode / Encode h264 Decode / Encode
Decode / Encode VP8 Decode / Encode
Decode / Encode h265 / HEVC (8 bit) Decode / Encode
No JPEG Decode / Encode
No AV1 No
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 16.0 GB distributed across 4 memory channels. It offers a peak memory bandwidth of 55.3 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
The processor supports a maximum memory capacity of 32.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 38.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
4 Memory channels 2
16.0 GB Max. Memory 32.0 GB
pci PCIe pci
No AES-NI Yes
No ECC Yes
55.3 GB/s Bandwidth 38.4 GB/s
LPDDR4X-4266 Memory type DDR4-2400
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 15 W watts.
None TDP up 25 W
-- Tjunction max 105 °C
None TDP (PL1 / PBP) 15 W
None TDP down 12 W
 
 

Technical details

The Qualcomm Snapdragon 855 is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The AMD Ryzen Embedded R2312 is manufactured using a 12 nm process.
Q4/2018 Release date Q2/2022
SM8150 Part Number --
1.8 MB L2-Cache 1.0 MB
None Virtualization AMD-V, SVM
ISA extensions SSE4a, SSE4.1, SSE4.2, FMA3, AVX2
Chiplet Chip design Chiplet
Kryo 485 Architecture Zen+
7 nm Technology 12 nm
Socket FP5
Android Operating systems Windows 10, Linux
-- Release price --
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
2.0 MB L3-Cache 2.0 MB