Qualcomm Snapdragon 855 vs HiSilicon Kirin 955

Qualcomm Snapdragon 855 or Qualcomm Snapdragon 855 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 855 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q4/2018 and belongs to the 6 generation of the Qualcomm Snapdragon series.
The HiSilicon Kirin 955 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.

The Qualcomm Snapdragon 855 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.84 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 955 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.5 GHz.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.

The Qualcomm Snapdragon 855 has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 855 uses the Qualcomm Adreno 640, which has 384 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The HiSilicon Kirin 955 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 955 uses the ARM Mali-T880 MP4, which has 64 texture shaders

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

The processor supports a maximum memory capacity of 16.0 GB distributed across 4 memory channels. It offers a peak memory bandwidth of 55.3 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.

The Qualcomm Snapdragon 855 is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 955 is manufactured using a 16 nm process.