Qualcomm Snapdragon 860 vs Intel Core2 Duo E6750

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 860 or Qualcomm Snapdragon 860 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 860 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q1/2021 and belongs to the 6 generation of the Qualcomm Snapdragon series.
The Intel Core2 Duo E6750 features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q3/2007 and belongs to the 1 generation of the Intel Core2 Duo series.
To use the Intel Core2 Duo E6750, you'll need a motherboard with a LGA 775 socket.
Qualcomm Snapdragon 855/860 Group Intel Core 2 Duo E4000/E6000
6 Generation 1
Qualcomm Snapdragon 860 Name Intel Core2 Duo E6750
Mobile Segment Desktop / Server
Qualcomm Snapdragon Family Intel Core2 Duo
 
 

CPU Cores and Base Frequency

The Qualcomm Snapdragon 860 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.96 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The Intel Core2 Duo E6750 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Core2 Duo E6750 is 2.66 GHz
2.42 GHz B-Core Frequency None
None None 2x
hybrid (Prime / big.LITTLE) Core architecture normal
1x Kryo 485 Prime Cores A None
8 CPU Cores 2
4x Kryo 485 Silver Cores C None
No Overclocking Yes
1.8 GHz C-Core Frequency None
No Hyperthreading No
None None 2.66 GHz
2.96 GHz A-Core Frequency None
3x Kryo 485 Gold Cores B None
8 Threads 2
 
 

Internal Graphics

The Qualcomm Snapdragon 860 has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 860 uses the Qualcomm Adreno 640, which has 384 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Core2 Duo E6750 does not have integrated graphics.
0.68 GHz GPU (Turbo) --
7 nm Technology --
12.0 Direct X --
4.0 GB Max. GPU Memory 0 bytes
4 Execution units --
Q1/2019 Release date --
Qualcomm Adreno 640 GPU name
384 Shaders --
0.25 GHz GPU frequency --
5 Generation --
-- Max. displays --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode h265 / HEVC (8 bit) --
Decode / Encode VP9 --
Decode / Encode VP8 --
No VC-1 --
No JPEG --
Decode / Encode h264 --
Decode / Encode h265 / HEVC (10 bit) --
No AVC --
No AV1 --
 
 

Memory & PCIe

LPDDR4X-2133 Memory type DDR3-1333, DDR2-1066
-- Bandwidth --
No AES-NI No
No ECC No
pci PCIe pci
16.0 GB Max. Memory 16.0 GB
4 Memory channels 2
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 65 W watts.
None TDP (PL1 / PBP) 65 W
-- Tjunction max --
 
 

Technical details

The Qualcomm Snapdragon 860 is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 3.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Core2 Duo E6750 is manufactured using a 65 nm process.
None Virtualization VT-x
7 nm Technology 65 nm
ARMv8-A64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
ISA extensions SSE3, MMX, SSE, SSE2
SM8150-AC Part Number --
Chiplet Chip design Monolithic
Q1/2021 Release date Q3/2007
-- Release price --
2.0 MB L2-Cache 4.0 MB
Technical data sheet Documents Technical data sheet
3.0 MB L3-Cache 0 bytes
Socket LGA 775
Android Operating systems Windows 10, Linux
Kryo 485 Architecture Conroe (Core)