AMD A4-3310MX vs AMD C-70

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CPU comparison with benchmarks

-VS-

CPU lineage

AMD A4-3310MX or AMD A4-3310MX – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD A4-3310MX features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q2/2011 and belongs to the 1 generation of the AMD A series.
To use the AMD A4-3310MX, you'll need a motherboard with a FS1 socket.
The AMD C-70 features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q3/2012 and belongs to the 1 generation of the AMD C series.
To use the AMD C-70, you'll need a motherboard with a BGA 413 socket.
AMD A4-3310MX Name AMD C-70
1 Generation 1
Mobile Segment Mobile
AMD A Family AMD C
AMD A4-3000M Group AMD C
 
 

CPU Cores and Base Frequency

The AMD A4-3310MX has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the AMD A4-3310MX is 2.1 GHz
and turbo frequency for one core is 2.5 GHz.
The AMD C-70 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the AMD C-70 is 1.0 GHz
and turbo frequency for one core is 1.33 GHz.
2.5 GHz Turbo Frequency (1 core) 1.33 GHz
No Hyperthreading No
2.5 GHz Turbo Frequency (all cores) 1.33 GHz
2x Cores 2x
2.1 GHz Frequency 1.0 GHz
Yes Overclocking Yes
2 Threads 2
normal Core architecture normal
2 CPU Cores 2
 
 

Internal Graphics

The AMD A4-3310MX has integrated graphics, called iGPU for short.
Specifically, the AMD A4-3310MX uses the AMD Radeon HD 6480G, which has 240 texture shaders
and 3 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The AMD C-70 has integrated graphics, called iGPU for short.
Specifically, the AMD C-70 uses the AMD Radeon HD 6290, which has 80 texture shaders
and 1 execution units.
3 Execution units 1
AMD Radeon HD 6480G GPU name AMD Radeon HD 6290
11 Direct X 11
0.44 GHz GPU frequency 0.28 GHz
1.0 GB Max. GPU Memory 1.0 GB
-- GPU (Turbo) 0.4 GHz
3 Generation 3
Q2/2011 Release date Q3/2011
-- Max. displays --
32 nm Technology 40 nm
240 Shaders 80
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode JPEG Decode / Encode
Decode AVC Decode
No h265 / HEVC (8 bit) No
No VP8 No
Decode VC-1 Decode
No AV1 No
No VP9 No
No h265 / HEVC (10 bit) No
Decode h264 Decode
 
 

Memory & PCIe

pci PCIe pci
2 Memory channels 1
DDR3-1600 Memory type DDR3-1066
0 bytes Max. Memory 0 bytes
No ECC No
-- Bandwidth --
No AES-NI No
 
 

Thermal Management

The processor has a thermal design power (TDP) of 45 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 9 W watts.
45 W TDP (PL1 / PBP) 9 W
-- Tjunction max --
 
 

Technical details

The AMD A4-3310MX is manufactured using a 32 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The AMD C-70 is manufactured using a 40 nm process.
In total, this processor boasts a generous 1.0 MB cache.
0 bytes L2-Cache 0 bytes
Operating systems
-- Part Number --
AMD-V Virtualization AMD-V
2.0 MB L3-Cache 1.0 MB
Llano (K10) Architecture Ontario (Bobcat)
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
-- Release price --
Technical data sheet Documents Technical data sheet
SSE3, SSE4a ISA extensions SSE3, SSE4a
-- Chip design --
Q2/2011 Release date Q3/2012
FS1 Socket BGA 413
32 nm Technology 40 nm