AMD EPYC 7373X vs Intel Core2 Duo SP9600
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CPU comparison with benchmarks |
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CPU lineage |
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AMD EPYC 7373X or AMD EPYC 7373X – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD EPYC 7373X features 16 processor cores and has the capability to manage 32 threads concurrently. It was released in Q2/2022 and belongs to the 3 generation of the AMD EPYC series. To use the AMD EPYC 7373X, you'll need a motherboard with a SP3 socket. The Intel Core2 Duo SP9600 features 2 processor cores and has the capability to manage 2 threads concurrently. It was released in Q1/2009 and belongs to the 2 generation of the Intel Celeron series. To use the Intel Core2 Duo SP9600, you'll need a motherboard with a BGA 956 socket. |
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| 3 | Generation | 2 |
| AMD EPYC 7373X | Name | Intel Core2 Duo SP9600 |
| Desktop / Server | Segment | Mobile |
| AMD EPYC 7003 | Group | Intel Core 2 Duo P7000/SP9000 |
| AMD EPYC | Family | Intel Celeron |
CPU Cores and Base Frequency |
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The AMD EPYC 7373X has 16 CPU cores and can calculate 32 threads in parallel.
The clock frequency of the AMD EPYC 7373X is 3.05 GHz and turbo frequency for one core is 3.8 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. The Intel Core2 Duo SP9600 has 2 CPU cores and can calculate 2 threads in parallel. The clock frequency of the Intel Core2 Duo SP9600 is 2.53 GHz |
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| normal | Core architecture | normal |
| 3.8 GHz | Turbo Frequency (1 core) | None |
| 16 | CPU Cores | 2 |
| 16x Zen 3 | Cores | 2x |
| Yes | Hyperthreading | No |
| No | Overclocking | No |
| 3.05 GHz | Frequency | 2.53 GHz |
| 32 | Threads | 2 |
Internal Graphics |
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The AMD EPYC 7373X does not have integrated graphics.
The Intel Core2 Duo SP9600 does not have integrated graphics. |
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| -- | GPU (Turbo) | -- |
| 0 bytes | Max. GPU Memory | 0 bytes |
| -- | Max. displays | -- |
| -- | Execution units | -- |
| -- | Release date | -- |
| -- | Direct X | -- |
| -- | Technology | -- |
| -- | GPU frequency | -- |
| -- | Shaders | -- |
| GPU name | ||
| -- | Generation | -- |
Artificial Intelligence and Machine Learning |
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| -- | AI hardware | -- |
| -- | AI specifications | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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| -- | h265 / HEVC (10 bit) | -- |
| -- | h265 / HEVC (8 bit) | -- |
| -- | AVC | -- |
| -- | VP9 | -- |
| -- | JPEG | -- |
| -- | VP8 | -- |
| -- | VC-1 | -- |
| -- | AV1 | -- |
| -- | h264 | -- |
Memory & PCIe |
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The processor supports a maximum memory capacity of 4.0 TB distributed across 8 memory channels. It offers a peak memory bandwidth of 204.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
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| 8 | Memory channels | -- |
| 204.8 GB/s | Bandwidth | -- |
| 4.0 TB | Max. Memory | 0 bytes |
| Yes | ECC | Yes |
| pci | PCIe | pci |
| DDR4-3200 | Memory type | |
| Yes | AES-NI | No |
Thermal Management |
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The processor has a thermal design power (TDP) of 240 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself. The processor has a thermal design power (TDP) of 25 W watts. |
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| 225 W | TDP down | None |
| 240 W | TDP (PL1 / PBP) | 25 W |
| 280 W | TDP up | None |
| -- | Tjunction max | 105 °C |
Technical details |
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The AMD EPYC 7373X is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. In total, this processor boasts a generous 768.0 MB cache. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The Intel Core2 Duo SP9600 is manufactured using a 45 nm process. |
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| Technical data sheet | Documents | Technical data sheet |
| AMD-V, SVM | Virtualization | VT-x |
| SP3 | Socket | BGA 956 |
| Windows 10, Linux | Operating systems | |
| Chiplet | Chip design | Monolithic |
| SSE4a, SSE4.1, SSE4.2, FMA3, AVX2 | ISA extensions | SSE3, MMX, SSE, SSE2, SSE 4.1 |
| Q2/2022 | Release date | Q1/2009 |
| 3900 $ | Release price | -- |
| x86-64 (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
| 7 nm | Technology | 45 nm |
| Milan (Zen 3) | Architecture | Wolfdale (Penryn) |
| -- | Part Number | -- |
| 768.0 MB | L3-Cache | 0 bytes |
| 32.0 MB | L2-Cache | 6.0 MB |
