AMD EPYC 7373X vs Intel Core2 Duo SP9600

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CPU comparison with benchmarks

-VS-

CPU lineage

AMD EPYC 7373X or AMD EPYC 7373X – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD EPYC 7373X features 16 processor cores and has the capability to manage 32 threads concurrently.
It was released in Q2/2022 and belongs to the 3 generation of the AMD EPYC series.
To use the AMD EPYC 7373X, you'll need a motherboard with a SP3 socket.
The Intel Core2 Duo SP9600 features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q1/2009 and belongs to the 2 generation of the Intel Celeron series.
To use the Intel Core2 Duo SP9600, you'll need a motherboard with a BGA 956 socket.
AMD EPYC 7373X Name Intel Core2 Duo SP9600
3 Generation 2
Desktop / Server Segment Mobile
AMD EPYC Family Intel Celeron
AMD EPYC 7003 Group Intel Core 2 Duo P7000/SP9000
 
 

CPU Cores and Base Frequency

The AMD EPYC 7373X has 16 CPU cores and can calculate 32 threads in parallel.
The clock frequency of the AMD EPYC 7373X is 3.05 GHz
and turbo frequency for one core is 3.8 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The Intel Core2 Duo SP9600 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Core2 Duo SP9600 is 2.53 GHz
3.8 GHz Turbo Frequency (1 core) None
Yes Hyperthreading No
16x Zen 3 Cores 2x
3.05 GHz Frequency 2.53 GHz
No Overclocking No
32 Threads 2
normal Core architecture normal
16 CPU Cores 2
 
 

Internal Graphics

The AMD EPYC 7373X does not have integrated graphics.
The Intel Core2 Duo SP9600 does not have integrated graphics.
-- Execution units --
GPU name
-- Direct X --
-- GPU frequency --
0 bytes Max. GPU Memory 0 bytes
-- GPU (Turbo) --
-- Generation --
-- Release date --
-- Max. displays --
-- Technology --
-- Shaders --
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- JPEG --
-- AVC --
-- h265 / HEVC (8 bit) --
-- VP8 --
-- VC-1 --
-- AV1 --
-- VP9 --
-- h265 / HEVC (10 bit) --
-- h264 --
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 4.0 TB distributed across 8 memory channels. It offers a peak memory bandwidth of 204.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
pci PCIe pci
8 Memory channels --
DDR4-3200 Memory type
4.0 TB Max. Memory 0 bytes
Yes ECC Yes
204.8 GB/s Bandwidth --
Yes AES-NI No
 
 

Thermal Management

The processor has a thermal design power (TDP) of 240 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 25 W watts.
280 W TDP up None
240 W TDP (PL1 / PBP) 25 W
-- Tjunction max 105 °C
225 W TDP down None
 
 

Technical details

The AMD EPYC 7373X is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 768.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Core2 Duo SP9600 is manufactured using a 45 nm process.
32.0 MB L2-Cache 6.0 MB
Windows 10, Linux Operating systems
-- Part Number --
AMD-V, SVM Virtualization VT-x
768.0 MB L3-Cache 0 bytes
Milan (Zen 3) Architecture Wolfdale (Penryn)
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
3900 $ Release price --
Technical data sheet Documents Technical data sheet
SSE4a, SSE4.1, SSE4.2, FMA3, AVX2 ISA extensions SSE3, MMX, SSE, SSE2, SSE 4.1
Chiplet Chip design Monolithic
Q2/2022 Release date Q1/2009
SP3 Socket BGA 956
7 nm Technology 45 nm