AMD EPYC 7473X vs HiSilicon Kirin 990 4G

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CPU comparison with benchmarks

-VS-

CPU lineage

AMD EPYC 7473X or AMD EPYC 7473X – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD EPYC 7473X features 24 processor cores and has the capability to manage 48 threads concurrently.
It was released in Q2/2022 and belongs to the 3 generation of the AMD EPYC series.
To use the AMD EPYC 7473X, you'll need a motherboard with a SP3 socket.
The HiSilicon Kirin 990 4G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2019 and belongs to the 8 generation of the HiSilicon Kirin series.
AMD EPYC 7003 Group HiSilicon Kirin 990
3 Generation 8
Desktop / Server Segment Mobile
AMD EPYC 7473X Name HiSilicon Kirin 990 4G
AMD EPYC Family HiSilicon Kirin
 
 

CPU Cores and Base Frequency

The AMD EPYC 7473X has 24 CPU cores and can calculate 48 threads in parallel.
The clock frequency of the AMD EPYC 7473X is 2.8 GHz
and turbo frequency for one core is 3.7 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 990 4G has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.86 GHz.
None None 4x Cortex-A55
48 Threads 8
24x Zen 3 Cores None
None None 2.09 GHz
24 CPU Cores 8
normal Core architecture hybrid (Prime / big.LITTLE)
None None 2x Cortex-A76
Yes Hyperthreading No
None None 2.86 GHz
No Overclocking No
None None 2x Cortex-A76
None None 1.86 GHz
3.7 GHz Turbo Frequency (1 core) None
2.8 GHz Frequency None
 
 

Internal Graphics

The AMD EPYC 7473X does not have integrated graphics.
The HiSilicon Kirin 990 4G has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 990 4G uses the ARM Mali-G76 MP16, which has 256 texture shaders
and 16 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Shaders 256
-- Release date Q3/2018
-- Technology 7 nm
-- Direct X 12
0 bytes Max. GPU Memory 4.0 GB
-- Max. displays --
-- Execution units 16
-- GPU frequency 0.6 GHz
-- Generation Bifrost 3
-- GPU (Turbo) --
GPU name ARM Mali-G76 MP16
 
 

Artificial Intelligence and Machine Learning

-- AI specifications Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny
-- AI hardware HUAWEI HiAI 2.0
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP8 Decode / Encode
-- VC-1 Decode / Encode
-- JPEG Decode / Encode
-- AV1 No
-- h265 / HEVC (8 bit) Decode / Encode
-- AVC Decode / Encode
-- h264 Decode / Encode
-- VP9 Decode / Encode
-- h265 / HEVC (10 bit) Decode / Encode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 4.0 TB distributed across 8 memory channels. It offers a peak memory bandwidth of 204.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
pci PCIe pci
Yes AES-NI No
DDR4-3200 Memory type LPDDR4X-2133
Yes ECC No
4.0 TB Max. Memory 8.0 GB
8 Memory channels 4
204.8 GB/s Bandwidth --
 
 

Thermal Management

The processor has a thermal design power (TDP) of 240 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 6 W watts.
225 W TDP down None
280 W TDP up None
240 W TDP (PL1 / PBP) 6 W
-- Tjunction max --
 
 

Technical details

The AMD EPYC 7473X is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 768.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 990 4G is manufactured using a 7 nm process.
In total, this processor boasts a generous 2.0 MB cache.
Q2/2022 Release date Q3/2019
AMD-V, SVM Virtualization None
SSE4a, SSE4.1, SSE4.2, FMA3, AVX2 ISA extensions
7 nm Technology 7 nm
Chiplet Chip design Chiplet
4185 $ Release price --
Milan (Zen 3) Architecture Cortex-A76 / Cortex-A55
768.0 MB L3-Cache 2.0 MB
Windows 10, Linux Operating systems Android
Technical data sheet Documents Technical data sheet
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
-- Part Number --
SP3 Socket
32.0 MB L2-Cache 0 bytes