HiSilicon Kirin 650 vs AMD Ryzen 7 3800X

HiSilicon Kirin 650 or HiSilicon Kirin 650 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 650 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
The AMD Ryzen 7 3800X features 8 processor cores and has the capability to manage 16 threads concurrently.
It was released in Q3/2019 and belongs to the 3 generation of the AMD Ryzen 7 series.
To use the AMD Ryzen 7 3800X, you'll need a motherboard with a AM4 (PGA 1331) socket.

The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.0 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The AMD Ryzen 7 3800X has 8 CPU cores and can calculate 16 threads in parallel.
The clock frequency of the AMD Ryzen 7 3800X is 3.9 GHz
and turbo frequency for one core is 4.5 GHz.

The HiSilicon Kirin 650 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 650 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The AMD Ryzen 7 3800X does not have integrated graphics.

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 105 W watts.

The HiSilicon Kirin 650 is manufactured using a 16 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The AMD Ryzen 7 3800X is manufactured using a 7 nm process.
In total, this processor boasts a generous 32.0 MB cache.