HiSilicon Kirin 650 Benchmark, Test and specs

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CPU lineage

The HiSilicon Kirin 650 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
Name: HiSilicon Kirin 650
Family: HiSilicon Kirin
Group: HiSilicon Kirin 650
Segment: Mobile
Generation: 4

CPU Cores and Base Frequency

The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.0 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
CPU Cores: 8
Threads: 8
Cores A: 4x Cortex-A53
Cores B: 4x Cortex-A53
Core architecture: hybrid (big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 2.0 GHz
B-Core Frequency: 1.7 GHz

Internal Graphics

The HiSilicon Kirin 650 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 650 uses the ARM Mali-T830 MP2, which has 32 texture shaders and 2 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: ARM Mali-T830 MP2
GPU frequency: 0.9 GHz
GPU (Turbo): --
Execution units: 2
Shaders: 32
Max. GPU Memory: 0 bytes
Max. displays: --
Generation: Midgard 4
Direct X: 11
Technology: 28 nm
Release date: Q4/2015

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode
h264: Decode / Encode
VP8: Decode / Encode
VP9: No
AV1: No
AVC: No
VC-1: No
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR3-933
Max. Memory: 0 bytes
Memory channels: 2
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): None
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The HiSilicon Kirin 650 is manufactured using a 16 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 16 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 0 bytes
Architecture: Cortex-A53 / Cortex-A53
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv8-A64 (64 bit)
ISA extensions:
Release date: Q2/2016
Release price: --
Part Number: --
Documents: Technical data sheet
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Benchmarks

Geekbench 5, 64bit (Multi-Core)

Intel Core2 Duo E7400
2C 2T @ 2.8 GHz
765
765
Intel Celeron J3160
4C 4T @ 1.6 GHz
764
764
HiSilicon Kirin 650
8C 8T @ 2.0 GHz
763
763
AMD Athlon II X2 250
2C 2T @ 3.0 GHz
756
756
Intel Celeron N4000C
2C 2T @ 1.1 GHz
755
755

Geekbench 5, 64bit (Single-Core)

Qualcomm Snapdragon 429
NoneC NoneT @ --
167
167
MediaTek MT8766B
NoneC NoneT @ --
163
163
HiSilicon Kirin 650
8C 8T @ 2.0 GHz
163
163
MediaTek MT8766B
NoneC NoneT @ --
163
163
Qualcomm Snapdragon 805
NoneC NoneT @ --
162
162

iGPU - FP32 Performance (Single-precision GFLOPS)

Samsung Exynos 7880
NoneC NoneT @ --
61
61
HiSilicon Kirin 655
8C 8T @ 2.12 GHz
61
61
HiSilicon Kirin 650
8C 8T @ 2.0 GHz
61
61
HiSilicon Kirin 658
8C 8T @ 2.35 GHz
61
61
HiSilicon Kirin 655
8C 8T @ 2.12 GHz
61
61