AMD A6-3400M vs HiSilicon Kirin 650

Last updated:

CPU comparison with benchmarks

-VS-

CPU lineage

AMD A6-3400M or AMD A6-3400M – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD A6-3400M features 4 processor cores and has the capability to manage 4 threads concurrently.
It was released in Q2/2011 and belongs to the 1 generation of the AMD A series.
To use the AMD A6-3400M, you'll need a motherboard with a FS1 socket.
The HiSilicon Kirin 650 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
1 Generation 4
AMD A Family HiSilicon Kirin
AMD A6-3000M Group HiSilicon Kirin 650
AMD A6-3400M Name HiSilicon Kirin 650
Mobile Segment Mobile
 
 

CPU Cores and Base Frequency

The AMD A6-3400M has 4 CPU cores and can calculate 4 threads in parallel.
The clock frequency of the AMD A6-3400M is 1.4 GHz
and turbo frequency for one core is 2.3 GHz.
The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.0 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
None None 4x Cortex-A53
4 CPU Cores 8
None None 1.7 GHz
4 Threads 8
2.3 GHz Turbo Frequency (1 core) None
1.4 GHz Frequency None
4x Cores None
normal Core architecture hybrid (big.LITTLE)
Yes Overclocking No
None None 2.0 GHz
No Hyperthreading No
2.3 GHz Turbo Frequency (all cores) None
None None 4x Cortex-A53
 
 

Internal Graphics

The AMD A6-3400M has integrated graphics, called iGPU for short.
Specifically, the AMD A6-3400M uses the AMD Radeon HD 6520G, which has 320 texture shaders
and 5 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The HiSilicon Kirin 650 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 650 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
3 Generation Midgard 4
Q2/2011 Release date Q4/2015
-- Max. displays --
5 Execution units 2
320 Shaders 32
-- GPU (Turbo) --
0.4 GHz GPU frequency 0.9 GHz
32 nm Technology 28 nm
AMD Radeon HD 6520G GPU name ARM Mali-T830 MP2
1.0 GB Max. GPU Memory 0 bytes
11 Direct X 11
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode JPEG Decode / Encode
Decode h264 Decode / Encode
No AV1 No
No VP9 No
No h265 / HEVC (10 bit) Decode
Decode AVC No
No h265 / HEVC (8 bit) Decode / Encode
No VP8 Decode / Encode
Decode VC-1 No
 
 

Memory & PCIe

2 Memory channels 2
0 bytes Max. Memory 0 bytes
DDR3-1333 Memory type LPDDR3-933
No AES-NI No
-- Bandwidth --
No ECC No
pci PCIe pci
 
 

Thermal Management

The processor has a thermal design power (TDP) of 35 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
35 W TDP (PL1 / PBP) None
-- Tjunction max --
 
 

Technical details

The AMD A6-3400M is manufactured using a 32 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 4.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 650 is manufactured using a 16 nm process.
Q2/2011 Release date Q2/2016
Llano (K10) Architecture Cortex-A53 / Cortex-A53
Technical data sheet Documents Technical data sheet
AMD-V Virtualization None
-- Chip design Chiplet
4.0 MB L3-Cache 0 bytes
SSE3, SSE4a ISA extensions
32 nm Technology 16 nm
FS1 Socket
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
-- Part Number --
-- Release price --
Operating systems Android
0 bytes L2-Cache 0 bytes