Qualcomm Snapdragon 205 vs HiSilicon Kirin 650

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 205 or Qualcomm Snapdragon 205 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 650 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
-- Generation 4
Family HiSilicon Kirin
-- Segment Mobile
Qualcomm Snapdragon 205 Name HiSilicon Kirin 650
Group HiSilicon Kirin 650
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.0 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
None None 4x Cortex-A53
None None 2.0 GHz
No Overclocking No
None None 1.7 GHz
None None 4x Cortex-A53
No Hyperthreading No
-- Threads 8
-- Core architecture hybrid (big.LITTLE)
-- CPU Cores 8
 
 

Internal Graphics

The Qualcomm Snapdragon 205 does not have integrated graphics.
The HiSilicon Kirin 650 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 650 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Execution units 2
0 bytes Max. GPU Memory 0 bytes
-- Technology 28 nm
-- GPU (Turbo) --
-- Direct X 11
-- Max. displays --
-- GPU frequency 0.9 GHz
-- Shaders 32
-- Generation Midgard 4
-- Release date Q4/2015
GPU name ARM Mali-T830 MP2
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VC-1 No
-- AVC No
-- VP8 Decode / Encode
-- h265 / HEVC (8 bit) Decode / Encode
-- h265 / HEVC (10 bit) Decode
-- JPEG Decode / Encode
-- h264 Decode / Encode
-- VP9 No
-- AV1 No
 
 

Memory & PCIe

pci PCIe pci
0 bytes Max. Memory 0 bytes
Memory type LPDDR3-933
No AES-NI No
No ECC No
-- Bandwidth --
-- Memory channels 2
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 650 is manufactured using a 16 nm process.
Technical data sheet Documents Technical data sheet
Operating systems Android
-- Technology 16 nm
Instruction set (ISA) ARMv8-A64 (64 bit)
-- Part Number --
-- Release price --
Socket
-- Release date Q2/2016
ISA extensions
-- Architecture Cortex-A53 / Cortex-A53
0 bytes L3-Cache 0 bytes
-- Chip design Chiplet
Virtualization None
0 bytes L2-Cache 0 bytes