CPU comparison with benchmarks |
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CPU lineage |
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Qualcomm Snapdragon 205 or Qualcomm Snapdragon 205 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 650 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series. |
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| -- | Generation | 4 |
| Family | HiSilicon Kirin | |
| Group | HiSilicon Kirin 650 | |
| Qualcomm Snapdragon 205 | Name | HiSilicon Kirin 650 |
| -- | Segment | Mobile |
CPU Cores and Base Frequency |
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The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.0 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices. |
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| None | None | 1.7 GHz |
| -- | Threads | 8 |
| No | Hyperthreading | No |
| None | None | 4x Cortex-A53 |
| -- | CPU Cores | 8 |
| -- | Core architecture | hybrid (big.LITTLE) |
| No | Overclocking | No |
| None | None | 2.0 GHz |
| None | None | 4x Cortex-A53 |
Internal Graphics |
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The Qualcomm Snapdragon 205 does not have integrated graphics.
The HiSilicon Kirin 650 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 650 uses the ARM Mali-T830 MP2, which has 32 texture shaders and 2 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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| -- | Generation | Midgard 4 |
| -- | Release date | Q4/2015 |
| -- | Max. displays | -- |
| -- | Execution units | 2 |
| -- | Shaders | 32 |
| -- | GPU (Turbo) | -- |
| -- | GPU frequency | 0.9 GHz |
| -- | Technology | 28 nm |
| GPU name | ARM Mali-T830 MP2 | |
| 0 bytes | Max. GPU Memory | 0 bytes |
| -- | Direct X | 11 |
Artificial Intelligence and Machine Learning |
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| -- | AI specifications | -- |
| -- | AI hardware | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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| -- | JPEG | Decode / Encode |
| -- | h264 | Decode / Encode |
| -- | AV1 | No |
| -- | VP9 | No |
| -- | h265 / HEVC (10 bit) | Decode |
| -- | AVC | No |
| -- | h265 / HEVC (8 bit) | Decode / Encode |
| -- | VP8 | Decode / Encode |
| -- | VC-1 | No |
Memory & PCIe |
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| -- | Memory channels | 2 |
| 0 bytes | Max. Memory | 0 bytes |
| Memory type | LPDDR3-933 | |
| No | AES-NI | No |
| -- | Bandwidth | -- |
| No | ECC | No |
| pci | PCIe | pci |
Thermal Management |
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TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
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| -- | Tjunction max | -- |
Technical details |
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A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The HiSilicon Kirin 650 is manufactured using a 16 nm process. |
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| -- | Release date | Q2/2016 |
| -- | Architecture | Cortex-A53 / Cortex-A53 |
| Technical data sheet | Documents | Technical data sheet |
| Virtualization | None | |
| -- | Chip design | Chiplet |
| 0 bytes | L3-Cache | 0 bytes |
| ISA extensions | ||
| -- | Technology | 16 nm |
| Socket | ||
| Instruction set (ISA) | ARMv8-A64 (64 bit) | |
| -- | Part Number | -- |
| -- | Release price | -- |
| Operating systems | Android | |
| 0 bytes | L2-Cache | 0 bytes |
Geekbench 5, 64bit (Multi-Core)
Geekbench 5, 64bit (Single-Core)
iGPU - FP32 Performance (Single-precision GFLOPS)
