Qualcomm Snapdragon 205 vs HiSilicon Kirin 650

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 205 or Qualcomm Snapdragon 205 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 650 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
-- Generation 4
Family HiSilicon Kirin
Qualcomm Snapdragon 205 Name HiSilicon Kirin 650
Group HiSilicon Kirin 650
-- Segment Mobile
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.0 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
-- Threads 8
-- CPU Cores 8
None None 4x Cortex-A53
-- Core architecture hybrid (big.LITTLE)
None None 4x Cortex-A53
No Overclocking No
None None 1.7 GHz
No Hyperthreading No
None None 2.0 GHz
 
 

Internal Graphics

The Qualcomm Snapdragon 205 does not have integrated graphics.
The HiSilicon Kirin 650 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 650 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Generation Midgard 4
0 bytes Max. GPU Memory 0 bytes
-- Technology 28 nm
-- Execution units 2
-- Max. displays --
-- Shaders 32
-- Release date Q4/2015
-- Direct X 11
-- GPU (Turbo) --
-- GPU frequency 0.9 GHz
GPU name ARM Mali-T830 MP2
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- h265 / HEVC (8 bit) Decode / Encode
-- JPEG Decode / Encode
-- h265 / HEVC (10 bit) Decode
-- VP8 Decode / Encode
-- AV1 No
-- AVC No
-- VP9 No
-- h264 Decode / Encode
-- VC-1 No
 
 

Memory & PCIe

No AES-NI No
Memory type LPDDR3-933
-- Memory channels 2
0 bytes Max. Memory 0 bytes
No ECC No
-- Bandwidth --
pci PCIe pci
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 650 is manufactured using a 16 nm process.
-- Release price --
0 bytes L2-Cache 0 bytes
-- Chip design Chiplet
-- Technology 16 nm
0 bytes L3-Cache 0 bytes
-- Architecture Cortex-A53 / Cortex-A53
Technical data sheet Documents Technical data sheet
Instruction set (ISA) ARMv8-A64 (64 bit)
Operating systems Android
-- Release date Q2/2016
Socket
Virtualization None
-- Part Number --
ISA extensions