Intel Core2 Duo T5550 vs HiSilicon Kirin 650

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Core2 Duo T5550 or Intel Core2 Duo T5550 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Core2 Duo T5550 features 2 processor cores and has the capability to manage 2 threads concurrently.
It belongs to the 1 generation of the Intel Celeron series.
To use the Intel Core2 Duo T5550, you'll need a motherboard with a PGA 478 socket.
The HiSilicon Kirin 650 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
Mobile Segment Mobile
Intel Core2 Duo T5550 Name HiSilicon Kirin 650
Intel Core 2 Duo T5000 Group HiSilicon Kirin 650
1 Generation 4
Intel Celeron Family HiSilicon Kirin
 
 

CPU Cores and Base Frequency

The Intel Core2 Duo T5550 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Core2 Duo T5550 is 1.83 GHz
The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.0 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
None None 2.0 GHz
2 CPU Cores 8
None None 1.7 GHz
2 Threads 8
1.83 GHz Frequency None
normal Core architecture hybrid (big.LITTLE)
No Overclocking No
None None 4x Cortex-A53
None None 4x Cortex-A53
2x Cores None
No Hyperthreading No
 
 

Internal Graphics

The Intel Core2 Duo T5550 does not have integrated graphics.
The HiSilicon Kirin 650 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 650 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Direct X 11
-- Execution units 2
0 bytes Max. GPU Memory 0 bytes
-- Max. displays --
-- Release date Q4/2015
-- GPU (Turbo) --
-- Shaders 32
GPU name ARM Mali-T830 MP2
-- Generation Midgard 4
-- GPU frequency 0.9 GHz
-- Technology 28 nm
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP8 Decode / Encode
-- AVC No
-- h265 / HEVC (8 bit) Decode / Encode
-- AV1 No
-- VC-1 No
-- h264 Decode / Encode
-- VP9 No
-- h265 / HEVC (10 bit) Decode
-- JPEG Decode / Encode
 
 

Memory & PCIe

Memory type LPDDR3-933
-- Bandwidth --
No ECC No
-- Memory channels 2
pci PCIe pci
No AES-NI No
0 bytes Max. Memory 0 bytes
 
 

Thermal Management

The processor has a thermal design power (TDP) of 35 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
100 °C Tjunction max --
35 W TDP (PL1 / PBP) None
 
 

Technical details

The Intel Core2 Duo T5550 is manufactured using a 65 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 650 is manufactured using a 16 nm process.
Monolithic Chip design Chiplet
0 bytes L3-Cache 0 bytes
PGA 478 Socket
Technical data sheet Documents Technical data sheet
Operating systems Android
2.0 MB L2-Cache 0 bytes
-- Release date Q2/2016
Merom (Core) Architecture Cortex-A53 / Cortex-A53
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
-- Release price --
SSE3, MMX, SSE, SSE2 ISA extensions
VT-x Virtualization None
-- Part Number --
65 nm Technology 16 nm