iGPU - FP32 Performance (Single-precision GFLOPS)
HiSilicon Kirin 650
8C 8T @ 2.0 GHz
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61
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CPU comparison with benchmarks |
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-VS- | ||
CPU lineage |
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Intel Core2 Duo T5550 or Intel Core2 Duo T5550 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Core2 Duo T5550 features 2 processor cores and has the capability to manage 2 threads concurrently. It belongs to the 1 generation of the Intel Celeron series. To use the Intel Core2 Duo T5550, you'll need a motherboard with a PGA 478 socket. The HiSilicon Kirin 650 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series. |
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Mobile | Segment | Mobile |
Intel Core2 Duo T5550 | Name | HiSilicon Kirin 650 |
Intel Core 2 Duo T5000 | Group | HiSilicon Kirin 650 |
1 | Generation | 4 |
Intel Celeron | Family | HiSilicon Kirin |
CPU Cores and Base Frequency |
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The Intel Core2 Duo T5550 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Core2 Duo T5550 is 1.83 GHz The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.0 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices. |
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2 | Threads | 8 |
2 | CPU Cores | 8 |
normal | Core architecture | hybrid (big.LITTLE) |
None | None | 1.7 GHz |
None | None | 4x Cortex-A53 |
None | None | 4x Cortex-A53 |
No | Overclocking | No |
No | Hyperthreading | No |
2x | Cores | None |
1.83 GHz | Frequency | None |
None | None | 2.0 GHz |
Internal Graphics |
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The Intel Core2 Duo T5550 does not have integrated graphics.
The HiSilicon Kirin 650 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 650 uses the ARM Mali-T830 MP2, which has 32 texture shaders and 2 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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-- | GPU frequency | 0.9 GHz |
-- | Execution units | 2 |
-- | Release date | Q4/2015 |
-- | GPU (Turbo) | -- |
-- | Max. displays | -- |
-- | Shaders | 32 |
0 bytes | Max. GPU Memory | 0 bytes |
-- | Generation | Midgard 4 |
-- | Direct X | 11 |
-- | Technology | 28 nm |
GPU name | ARM Mali-T830 MP2 | |
Artificial Intelligence and Machine Learning |
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-- | AI specifications | -- |
-- | AI hardware | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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-- | h265 / HEVC (8 bit) | Decode / Encode |
-- | AV1 | No |
-- | VP9 | No |
-- | VC-1 | No |
-- | VP8 | Decode / Encode |
-- | h264 | Decode / Encode |
-- | JPEG | Decode / Encode |
-- | AVC | No |
-- | h265 / HEVC (10 bit) | Decode |
Memory & PCIe |
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0 bytes | Max. Memory | 0 bytes |
Memory type | LPDDR3-933 | |
pci | PCIe | pci |
No | AES-NI | No |
-- | Bandwidth | -- |
No | ECC | No |
-- | Memory channels | 2 |
Thermal Management |
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The processor has a thermal design power (TDP) of 35 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself. |
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35 W | TDP (PL1 / PBP) | None |
100 °C | Tjunction max | -- |
Technical details |
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The Intel Core2 Duo T5550 is manufactured using a 65 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The HiSilicon Kirin 650 is manufactured using a 16 nm process. |
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Operating systems | Android | |
2.0 MB | L2-Cache | 0 bytes |
SSE3, MMX, SSE, SSE2 | ISA extensions | |
0 bytes | L3-Cache | 0 bytes |
-- | Release date | Q2/2016 |
-- | Release price | -- |
Technical data sheet | Documents | Technical data sheet |
-- | Part Number | -- |
PGA 478 | Socket | |
Merom (Core) | Architecture | Cortex-A53 / Cortex-A53 |
VT-x | Virtualization | None |
65 nm | Technology | 16 nm |
Monolithic | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | ARMv8-A64 (64 bit) |