CPU comparison with benchmarks |
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CPU lineage |
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AMD Ryzen 3 3300X or AMD Ryzen 3 3300X – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD Ryzen 3 3300X features 4 processor cores and has the capability to manage 8 threads concurrently. It was released in Q2/2020 and belongs to the 3 generation of the AMD Ryzen 3 series. To use the AMD Ryzen 3 3300X, you'll need a motherboard with a AM4 (PGA 1331) socket. The Intel Core2 Duo T5550 features 2 processor cores and has the capability to manage 2 threads concurrently. It belongs to the 1 generation of the Intel Celeron series. To use the Intel Core2 Duo T5550, you'll need a motherboard with a PGA 478 socket. |
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3 | Generation | 1 |
AMD Ryzen 3 3300X | Name | Intel Core2 Duo T5550 |
AMD Ryzen 3 | Family | Intel Celeron |
Desktop / Server | Segment | Mobile |
AMD Ryzen 3000 | Group | Intel Core 2 Duo T5000 |
CPU Cores and Base Frequency |
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The AMD Ryzen 3 3300X has 4 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the AMD Ryzen 3 3300X is 3.8 GHz and turbo frequency for one core is 4.3 GHz. The Intel Core2 Duo T5550 has 2 CPU cores and can calculate 2 threads in parallel. The clock frequency of the Intel Core2 Duo T5550 is 1.83 GHz |
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8 | Threads | 2 |
Yes | Hyperthreading | No |
4.3 GHz | Turbo Frequency (all cores) | None |
3.8 GHz | Frequency | 1.83 GHz |
4 | CPU Cores | 2 |
normal | Core architecture | normal |
4.3 GHz | Turbo Frequency (1 core) | None |
4x | Cores | 2x |
Yes | Overclocking | No |
Internal Graphics |
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The AMD Ryzen 3 3300X does not have integrated graphics.
The Intel Core2 Duo T5550 does not have integrated graphics. |
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GPU name | ||
-- | Shaders | -- |
-- | Technology | -- |
-- | GPU frequency | -- |
-- | Execution units | -- |
-- | GPU (Turbo) | -- |
-- | Direct X | -- |
-- | Generation | -- |
0 bytes | Max. GPU Memory | 0 bytes |
-- | Release date | -- |
-- | Max. displays | -- |
Artificial Intelligence and Machine Learning |
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-- | AI hardware | -- |
-- | AI specifications | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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-- | JPEG | -- |
-- | AV1 | -- |
-- | VC-1 | -- |
-- | h265 / HEVC (10 bit) | -- |
-- | h265 / HEVC (8 bit) | -- |
-- | h264 | -- |
-- | VP8 | -- |
-- | AVC | -- |
-- | VP9 | -- |
Memory & PCIe |
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The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
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Yes | AES-NI | No |
Yes | ECC | No |
pci | PCIe | pci |
DDR4-3200 | Memory type | |
2 | Memory channels | -- |
128.0 GB | Max. Memory | 0 bytes |
51.2 GB/s | Bandwidth | -- |
Thermal Management |
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The processor has a thermal design power (TDP) of 65 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself. The processor has a thermal design power (TDP) of 35 W watts. |
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95 °C | Tjunction max | 100 °C |
65 W | TDP (PL1 / PBP) | 35 W |
Technical details |
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The AMD Ryzen 3 3300X is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. In total, this processor boasts a generous 16.0 MB cache. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The Intel Core2 Duo T5550 is manufactured using a 65 nm process. |
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-- | Release price | -- |
7 nm | Technology | 65 nm |
x86-64 (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
Technical data sheet | Documents | Technical data sheet |
2.0 MB | L2-Cache | 2.0 MB |
16.0 MB | L3-Cache | 0 bytes |
SSE4a, SSE4.1, SSE4.2, FMA3, AVX2 | ISA extensions | SSE3, MMX, SSE, SSE2 |
AMD-V, SVM | Virtualization | VT-x |
-- | Part Number | -- |
Chiplet | Chip design | Monolithic |
AM4 (PGA 1331) | Socket | PGA 478 |
Matisse (Zen 2) | Architecture | Merom (Core) |
Q2/2020 | Release date | -- |
Windows 10, Linux, Windows 11 | Operating systems | |