AMD Ryzen 3 3300X vs Intel Core2 Duo T5550

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CPU comparison with benchmarks

-VS-

CPU lineage

AMD Ryzen 3 3300X or AMD Ryzen 3 3300X – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD Ryzen 3 3300X features 4 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2020 and belongs to the 3 generation of the AMD Ryzen 3 series.
To use the AMD Ryzen 3 3300X, you'll need a motherboard with a AM4 (PGA 1331) socket.
The Intel Core2 Duo T5550 features 2 processor cores and has the capability to manage 2 threads concurrently.
It belongs to the 1 generation of the Intel Celeron series.
To use the Intel Core2 Duo T5550, you'll need a motherboard with a PGA 478 socket.
AMD Ryzen 3 Family Intel Celeron
Desktop / Server Segment Mobile
AMD Ryzen 3 3300X Name Intel Core2 Duo T5550
AMD Ryzen 3000 Group Intel Core 2 Duo T5000
3 Generation 1
 
 

CPU Cores and Base Frequency

The AMD Ryzen 3 3300X has 4 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the AMD Ryzen 3 3300X is 3.8 GHz
and turbo frequency for one core is 4.3 GHz.
The Intel Core2 Duo T5550 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Core2 Duo T5550 is 1.83 GHz
4x Cores 2x
4.3 GHz Turbo Frequency (all cores) None
3.8 GHz Frequency 1.83 GHz
4 CPU Cores 2
normal Core architecture normal
Yes Hyperthreading No
Yes Overclocking No
8 Threads 2
4.3 GHz Turbo Frequency (1 core) None
 
 

Internal Graphics

The AMD Ryzen 3 3300X does not have integrated graphics.
The Intel Core2 Duo T5550 does not have integrated graphics.
-- GPU (Turbo) --
-- Release date --
-- Execution units --
-- Direct X --
-- Max. displays --
-- Shaders --
GPU name
-- GPU frequency --
0 bytes Max. GPU Memory 0 bytes
-- Generation --
-- Technology --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP8 --
-- VP9 --
-- AVC --
-- h264 --
-- JPEG --
-- VC-1 --
-- AV1 --
-- h265 / HEVC (8 bit) --
-- h265 / HEVC (10 bit) --
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
Yes AES-NI No
128.0 GB Max. Memory 0 bytes
51.2 GB/s Bandwidth --
DDR4-3200 Memory type
pci PCIe pci
2 Memory channels --
Yes ECC No
 
 

Thermal Management

The processor has a thermal design power (TDP) of 65 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 35 W watts.
65 W TDP (PL1 / PBP) 35 W
95 °C Tjunction max 100 °C
 
 

Technical details

The AMD Ryzen 3 3300X is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 16.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Core2 Duo T5550 is manufactured using a 65 nm process.
Technical data sheet Documents Technical data sheet
Q2/2020 Release date --
AM4 (PGA 1331) Socket PGA 478
2.0 MB L2-Cache 2.0 MB
16.0 MB L3-Cache 0 bytes
Windows 10, Linux, Windows 11 Operating systems
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
-- Part Number --
Matisse (Zen 2) Architecture Merom (Core)
AMD-V, SVM Virtualization VT-x
-- Release price --
SSE4a, SSE4.1, SSE4.2, FMA3, AVX2 ISA extensions SSE3, MMX, SSE, SSE2
Chiplet Chip design Monolithic
7 nm Technology 65 nm