AMD Ryzen 3 3300X vs Intel Xeon E-2374G

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CPU comparison with benchmarks

-VS-

CPU lineage

AMD Ryzen 3 3300X or AMD Ryzen 3 3300X – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD Ryzen 3 3300X features 4 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2020 and belongs to the 3 generation of the AMD Ryzen 3 series.
To use the AMD Ryzen 3 3300X, you'll need a motherboard with a AM4 (PGA 1331) socket.
The Intel Xeon E-2374G features 4 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2021 and belongs to the 3 generation of the Intel Xeon E series.
To use the Intel Xeon E-2374G, you'll need a motherboard with a LGA 1200 socket.
AMD Ryzen 3 Family Intel Xeon E
Desktop / Server Segment Desktop / Server
AMD Ryzen 3000 Group Intel Xeon E-2300
3 Generation 3
AMD Ryzen 3 3300X Name Intel Xeon E-2374G
 
 

CPU Cores and Base Frequency

The AMD Ryzen 3 3300X has 4 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the AMD Ryzen 3 3300X is 3.8 GHz
and turbo frequency for one core is 4.3 GHz.
The Intel Xeon E-2374G has 4 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the Intel Xeon E-2374G is 3.7 GHz
and turbo frequency for one core is 5.0 GHz.
Yes Overclocking No
4.3 GHz Turbo Frequency (all cores) None
normal Core architecture normal
Yes Hyperthreading Yes
4 CPU Cores 4
4.3 GHz Turbo Frequency (1 core) 5.0 GHz
8 Threads 8
4x Cores 4x
3.8 GHz Frequency 3.7 GHz
 
 

Internal Graphics

The AMD Ryzen 3 3300X does not have integrated graphics.
The Intel Xeon E-2374G has integrated graphics, called iGPU for short.
Specifically, the Intel Xeon E-2374G uses the Intel UHD Graphics P750, which has 256 texture shaders
and 64 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Execution units 64
-- Technology 14 nm
-- Direct X 12
-- Release date Q2/2021
-- Shaders 256
-- GPU frequency 0.35 GHz
-- Max. displays --
GPU name Intel UHD Graphics P750
-- Generation 12
-- GPU (Turbo) 1.3 GHz
0 bytes Max. GPU Memory 32.0 GB
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- AVC Decode / Encode
-- h265 / HEVC (8 bit) Decode / Encode
-- h265 / HEVC (10 bit) Decode / Encode
-- VP9 Decode / Encode
-- AV1 Decode
-- JPEG Decode / Encode
-- h264 Decode / Encode
-- VP8 Decode
-- VC-1 Decode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
Yes ECC No
pci PCIe pci
2 Memory channels 2
51.2 GB/s Bandwidth 51.2 GB/s
DDR4-3200 Memory type DDR4-3200
Yes AES-NI Yes
128.0 GB Max. Memory 128.0 GB
 
 

Thermal Management

The processor has a thermal design power (TDP) of 65 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 80 W watts.
65 W TDP (PL1 / PBP) 80 W
95 °C Tjunction max 100 °C
 
 

Technical details

The AMD Ryzen 3 3300X is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 16.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Xeon E-2374G is manufactured using a 14 nm process.
In total, this processor boasts a generous 8.0 MB cache.
Windows 10, Linux, Windows 11 Operating systems Windows 10, Linux
7 nm Technology 14 nm
Chiplet Chip design Monolithic
SSE4a, SSE4.1, SSE4.2, FMA3, AVX2 ISA extensions SSE4.1, SSE4.2, AVX2, AVX-512
-- Part Number --
Q2/2020 Release date Q3/2021
Matisse (Zen 2) Architecture Rocket Lake S
Technical data sheet Documents Technical data sheet
AMD-V, SVM Virtualization VT-x, VT-x EPT, VT-d
AM4 (PGA 1331) Socket LGA 1200
2.0 MB L2-Cache 2.0 MB
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
16.0 MB L3-Cache 8.0 MB
-- Release price --