Intel Xeon E-2374G vs Qualcomm Snapdragon 670

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Xeon E-2374G or Intel Xeon E-2374G – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon E-2374G features 4 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2021 and belongs to the 3 generation of the Intel Xeon E series.
To use the Intel Xeon E-2374G, you'll need a motherboard with a LGA 1200 socket.
The Qualcomm Snapdragon 670 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2018 and belongs to the 6 generation of the Qualcomm Snapdragon series.
Intel Xeon E-2300 Group Qualcomm Snapdragon 670
3 Generation 6
Desktop / Server Segment Mobile
Intel Xeon E-2374G Name Qualcomm Snapdragon 670
Intel Xeon E Family Qualcomm Snapdragon
 
 

CPU Cores and Base Frequency

The Intel Xeon E-2374G has 4 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the Intel Xeon E-2374G is 3.7 GHz
and turbo frequency for one core is 5.0 GHz.
The Qualcomm Snapdragon 670 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.0 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
8 Threads 8
4x Cores None
None None 1.7 GHz
4 CPU Cores 8
normal Core architecture hybrid (big.LITTLE)
None None 2x Kryo 360 Gold
Yes Hyperthreading No
None None 2.0 GHz
No Overclocking No
None None 6x Kryo 360 Silver
5.0 GHz Turbo Frequency (1 core) None
3.7 GHz Frequency None
 
 

Internal Graphics

The Intel Xeon E-2374G has integrated graphics, called iGPU for short.
Specifically, the Intel Xeon E-2374G uses the Intel UHD Graphics P750, which has 256 texture shaders
and 64 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Qualcomm Snapdragon 670 has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 670 uses the Qualcomm Adreno 615, which has 256 texture shaders
256 Shaders 256
Q2/2021 Release date Q2/2018
14 nm Technology 10 nm
12 Direct X 12.1
32.0 GB Max. GPU Memory 0 bytes
-- Max. displays --
64 Execution units --
0.35 GHz GPU frequency 0.7 GHz
12 Generation 6
1.3 GHz GPU (Turbo) 0.7 GHz
Intel UHD Graphics P750 GPU name Qualcomm Adreno 615
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode VP8 Decode
Decode VC-1 Decode
Decode / Encode JPEG Decode
Decode AV1 No
Decode / Encode h265 / HEVC (8 bit) Decode
Decode / Encode AVC Decode
Decode / Encode h264 Decode
Decode / Encode VP9 Decode
Decode / Encode h265 / HEVC (10 bit) Decode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
pci PCIe pci
Yes AES-NI No
DDR4-3200 Memory type LPDDR4X-1866
No ECC No
128.0 GB Max. Memory 0 bytes
2 Memory channels 2
51.2 GB/s Bandwidth --
 
 

Thermal Management

The processor has a thermal design power (TDP) of 80 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
80 W TDP (PL1 / PBP) None
100 °C Tjunction max --
 
 

Technical details

The Intel Xeon E-2374G is manufactured using a 14 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 8.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Qualcomm Snapdragon 670 is manufactured using a 10 nm process.
Q3/2021 Release date Q3/2018
VT-x, VT-x EPT, VT-d Virtualization None
SSE4.1, SSE4.2, AVX2, AVX-512 ISA extensions
14 nm Technology 10 nm
Monolithic Chip design Chiplet
-- Release price --
Rocket Lake S Architecture Kryo 360
8.0 MB L3-Cache 0 bytes
Windows 10, Linux Operating systems Android
Technical data sheet Documents Technical data sheet
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
-- Part Number SDM670
LGA 1200 Socket
2.0 MB L2-Cache 0 bytes