Qualcomm Snapdragon 845 vs Qualcomm Snapdragon 670

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 845 or Qualcomm Snapdragon 845 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 845 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q1/2018 and belongs to the 5 generation of the Qualcomm Snapdragon series.
The Qualcomm Snapdragon 670 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2018 and belongs to the 6 generation of the Qualcomm Snapdragon series.
Qualcomm Snapdragon 845/850 Group Qualcomm Snapdragon 670
5 Generation 6
Mobile Segment Mobile
Qualcomm Snapdragon 845 Name Qualcomm Snapdragon 670
Qualcomm Snapdragon Family Qualcomm Snapdragon
 
 

CPU Cores and Base Frequency

The Qualcomm Snapdragon 845 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.8 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Qualcomm Snapdragon 670 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.0 GHz.
8 Threads 8
1.8 GHz B-Core Frequency 1.7 GHz
8 CPU Cores 8
hybrid (big.LITTLE) Core architecture hybrid (big.LITTLE)
4x Kryo 385 Gold Cores A 2x Kryo 360 Gold
No Hyperthreading No
2.8 GHz A-Core Frequency 2.0 GHz
No Overclocking No
4x Kryo 385 Silver Cores B 6x Kryo 360 Silver
 
 

Internal Graphics

The Qualcomm Snapdragon 845 has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 845 uses the Qualcomm Adreno 630, which has 256 texture shaders
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Qualcomm Snapdragon 670 has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 670 uses the Qualcomm Adreno 615, which has 256 texture shaders
256 Shaders 256
Q1/2018 Release date Q2/2018
10 nm Technology 10 nm
11 Direct X 12.1
8.0 GB Max. GPU Memory 0 bytes
-- Max. displays --
-- Execution units --
0.7 GHz GPU frequency 0.7 GHz
4 Generation 6
-- GPU (Turbo) 0.7 GHz
Qualcomm Adreno 630 GPU name Qualcomm Adreno 615
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode VP8 Decode
Decode VC-1 Decode
Decode / Encode JPEG Decode
No AV1 No
Decode h265 / HEVC (8 bit) Decode
Decode AVC Decode
Decode / Encode h264 Decode
Decode VP9 Decode
Decode h265 / HEVC (10 bit) Decode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 10.0 GB distributed across 4 memory channels. It offers a peak memory bandwidth of 52.0 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
pci PCIe pci
No AES-NI No
LPDDR4X-3733 Memory type LPDDR4X-1866
No ECC No
10.0 GB Max. Memory 0 bytes
4 Memory channels 2
52.0 GB/s Bandwidth --
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

The Qualcomm Snapdragon 845 is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Qualcomm Snapdragon 670 is manufactured using a 10 nm process.
Q1/2018 Release date Q3/2018
None Virtualization None
ISA extensions
10 nm Technology 10 nm
Chiplet Chip design Chiplet
-- Release price --
Kryo 385 Architecture Kryo 360
2.0 MB L3-Cache 0 bytes
Android Operating systems Android
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
SDM845 Part Number SDM670
Socket
1.5 MB L2-Cache 0 bytes