Intel Xeon W-1250TE vs Qualcomm Snapdragon 205
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CPU comparison with benchmarks |
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CPU lineage |
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Intel Xeon W-1250TE or Intel Xeon W-1250TE – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon W-1250TE features 6 processor cores and has the capability to manage 12 threads concurrently. It was released in Q2/2020 and belongs to the 10 generation of the Intel Xeon W series. To use the Intel Xeon W-1250TE, you'll need a motherboard with a LGA 1200 socket. |
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| Desktop / Server | Segment | -- |
| 10 | Generation | -- |
| Intel Xeon W | Family | |
| Intel Xeon W-1200 | Group | |
| Intel Xeon W-1250TE | Name | Qualcomm Snapdragon 205 |
CPU Cores and Base Frequency |
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The Intel Xeon W-1250TE has 6 CPU cores and can calculate 12 threads in parallel.
The clock frequency of the Intel Xeon W-1250TE is 2.4 GHz and turbo frequency for one core is 3.8 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. |
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| 12 | Threads | -- |
| normal | Core architecture | -- |
| 3.8 GHz | Turbo Frequency (1 core) | None |
| Yes | Hyperthreading | No |
| 6 | CPU Cores | -- |
| 6x | Cores | None |
| 2.8 GHz | Turbo Frequency (all cores) | None |
| No | Overclocking | No |
| 2.4 GHz | Frequency | None |
Internal Graphics |
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The Intel Xeon W-1250TE has integrated graphics, called iGPU for short.
Specifically, the Intel Xeon W-1250TE uses the Intel UHD Graphics P630, which has 192 texture shaders and 24 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. The Qualcomm Snapdragon 205 does not have integrated graphics. |
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| 9.5 | Generation | -- |
| 192 | Shaders | -- |
| -- | Max. displays | -- |
| 0.35 GHz | GPU frequency | -- |
| 1.2 GHz | GPU (Turbo) | -- |
| 24 | Execution units | -- |
| 64.0 GB | Max. GPU Memory | 0 bytes |
| 12 | Direct X | -- |
| 14 nm | Technology | -- |
| Intel UHD Graphics P630 | GPU name | |
| Q4/2017 | Release date | -- |
Artificial Intelligence and Machine Learning |
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| -- | AI specifications | -- |
| -- | AI hardware | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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| Decode / Encode | AVC | -- |
| No | AV1 | -- |
| Decode / Encode | VP8 | -- |
| Decode / Encode | JPEG | -- |
| Decode / Encode | h264 | -- |
| Decode / Encode | h265 / HEVC (10 bit) | -- |
| Decode / Encode | h265 / HEVC (8 bit) | -- |
| Decode / Encode | VP9 | -- |
| Decode | VC-1 | -- |
Memory & PCIe |
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The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 42.7 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
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| 128.0 GB | Max. Memory | 0 bytes |
| 2 | Memory channels | -- |
| pci | PCIe | pci |
| DDR4-2666 | Memory type | |
| Yes | AES-NI | No |
| Yes | ECC | No |
| 42.7 GB/s | Bandwidth | -- |
Thermal Management |
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The processor has a thermal design power (TDP) of 35 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself. |
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| 100 °C | Tjunction max | -- |
| 35 W | TDP (PL1 / PBP) | None |
Technical details |
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The Intel Xeon W-1250TE is manufactured using a 14 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. |
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| -- | Part Number | -- |
| LGA 1200 | Socket | |
| 260 $ | Release price | -- |
| Technical data sheet | Documents | Technical data sheet |
| 12.0 MB | L2-Cache | 0 bytes |
| Windows 10, Linux | Operating systems | |
| x86-64 (64 bit) | Instruction set (ISA) | |
| Monolithic | Chip design | -- |
| SSE4.1, SSE4.2, AVX2 | ISA extensions | |
| VT-x, VT-x EPT, VT-d | Virtualization | |
| Comet Lake W | Architecture | -- |
| 0 bytes | L3-Cache | 0 bytes |
| 14 nm | Technology | -- |
| Q2/2020 | Release date | -- |
