HiSilicon Kirin 655 Benchmark, Test and specs

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CPU lineage

The HiSilicon Kirin 655 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
Name: HiSilicon Kirin 655
Family: HiSilicon Kirin
Group: HiSilicon Kirin 650
Segment: Mobile
Generation: 4

CPU Cores and Base Frequency

The HiSilicon Kirin 655 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.12 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
CPU Cores: 8
Threads: 8
Cores A: 4x Cortex-A53
Cores B: 4x Cortex-A53
Core architecture: hybrid (big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 2.12 GHz
B-Core Frequency: 1.7 GHz

Internal Graphics

The HiSilicon Kirin 655 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 655 uses the ARM Mali-T830 MP2, which has 32 texture shaders and 2 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: ARM Mali-T830 MP2
GPU frequency: 0.9 GHz
GPU (Turbo): --
Execution units: 2
Shaders: 32
Max. GPU Memory: 0 bytes
Max. displays: --
Generation: Midgard 4
Direct X: 11
Technology: 28 nm
Release date: Q4/2015

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode
h264: Decode / Encode
VP8: Decode / Encode
VP9: No
AV1: No
AVC: No
VC-1: No
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR3-933
Max. Memory: 0 bytes
Memory channels: 2
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): None
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The HiSilicon Kirin 655 is manufactured using a 16 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 16 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 0 bytes
Architecture: Cortex-A53 / Cortex-A53
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv8-A64 (64 bit)
ISA extensions:
Release date: Q2/2016
Release price: --
Part Number: --
Documents: Technical data sheet
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Benchmarks

Geekbench 5, 64bit (Multi-Core)

Samsung Exynos 5433
NoneC NoneT @ --
798
798
Intel Core i5-2537M
2C 4T @ 1.4 GHz
795
795
HiSilicon Kirin 655
8C 8T @ 2.12 GHz
794
794
AMD A6-3410MX
4C 4T @ 1.6 GHz
793
793
AMD Athlon II X2 255
2C 2T @ 3.1 GHz
792
792

Geekbench 5, 64bit (Single-Core)

AMD Sempron 3850
4C 4T @ 1.3 GHz
170
170
Intel Atom E3827
2C 2T @ 1.75 GHz
170
170
HiSilicon Kirin 655
8C 8T @ 2.12 GHz
168
168
AMD E2-6110
4C 4T @ 1.5 GHz
167
167
Qualcomm Snapdragon 429
NoneC NoneT @ --
167
167

iGPU - FP32 Performance (Single-precision GFLOPS)

HiSilicon Kirin 650
8C 8T @ 2.0 GHz
61
61
Samsung Exynos 7880
NoneC NoneT @ --
61
61
HiSilicon Kirin 655
8C 8T @ 2.12 GHz
61
61
HiSilicon Kirin 658
8C 8T @ 2.35 GHz
61
61
Samsung Exynos 7880
NoneC NoneT @ --
61
61