Intel Xeon D-1653N vs HiSilicon Kirin 655

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Xeon D-1653N or Intel Xeon D-1653N – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon D-1653N features 8 processor cores and has the capability to manage 16 threads concurrently.
It was released in Q2/2019 and belongs to the 3 generation of the Intel Xeon D series.
To use the Intel Xeon D-1653N, you'll need a motherboard with a BGA 1667 socket.
The HiSilicon Kirin 655 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
Desktop / Server Segment Mobile
3 Generation 4
Intel Xeon D Family HiSilicon Kirin
Intel Xeon D-1600 Group HiSilicon Kirin 650
Intel Xeon D-1653N Name HiSilicon Kirin 655
 
 

CPU Cores and Base Frequency

The Intel Xeon D-1653N has 8 CPU cores and can calculate 16 threads in parallel.
The clock frequency of the Intel Xeon D-1653N is 2.8 GHz
and turbo frequency for one core is 3.2 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 655 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.12 GHz.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
16 Threads 8
normal Core architecture hybrid (big.LITTLE)
None None 4x Cortex-A53
3.2 GHz Turbo Frequency (1 core) None
None None 2.12 GHz
Yes Hyperthreading No
8 CPU Cores 8
8x Cores None
None None 4x Cortex-A53
3.0 GHz Turbo Frequency (all cores) None
No Overclocking No
None None 1.7 GHz
2.8 GHz Frequency None
 
 

Internal Graphics

The Intel Xeon D-1653N does not have integrated graphics.
The HiSilicon Kirin 655 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 655 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Generation Midgard 4
-- Shaders 32
-- Max. displays --
-- GPU frequency 0.9 GHz
-- GPU (Turbo) --
-- Execution units 2
0 bytes Max. GPU Memory 0 bytes
-- Direct X 11
-- Technology 28 nm
GPU name ARM Mali-T830 MP2
-- Release date Q4/2015
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- AVC No
-- AV1 No
-- VP8 Decode / Encode
-- JPEG Decode / Encode
-- h264 Decode / Encode
-- h265 / HEVC (10 bit) Decode
-- h265 / HEVC (8 bit) Decode / Encode
-- VP9 No
-- VC-1 No
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 38.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
128.0 GB Max. Memory 0 bytes
2 Memory channels 2
pci PCIe pci
DDR4-2400 Memory type LPDDR3-933
Yes AES-NI No
Yes ECC No
38.4 GB/s Bandwidth --
 
 

Thermal Management

The processor has a thermal design power (TDP) of 65 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
65 W TDP (PL1 / PBP) None
 
 

Technical details

The Intel Xeon D-1653N is manufactured using a 14 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 655 is manufactured using a 16 nm process.
-- Part Number --
BGA 1667 Socket
800 $ Release price --
Technical data sheet Documents Technical data sheet
12.0 MB L2-Cache 0 bytes
Windows 10, Linux Operating systems Android
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
Monolithic Chip design Chiplet
SSE4.1, SSE4.2, AVX2 ISA extensions
VT-x, VT-x EPT, VT-d Virtualization None
Hewitt Lake Architecture Cortex-A53 / Cortex-A53
0 bytes L3-Cache 0 bytes
14 nm Technology 16 nm
Q2/2019 Release date Q2/2016