Intel Xeon D-1653N vs HiSilicon Kirin 655

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Xeon D-1653N or Intel Xeon D-1653N – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon D-1653N features 8 processor cores and has the capability to manage 16 threads concurrently.
It was released in Q2/2019 and belongs to the 3 generation of the Intel Xeon D series.
To use the Intel Xeon D-1653N, you'll need a motherboard with a BGA 1667 socket.
The HiSilicon Kirin 655 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
Intel Xeon D-1653N Name HiSilicon Kirin 655
Intel Xeon D Family HiSilicon Kirin
Intel Xeon D-1600 Group HiSilicon Kirin 650
3 Generation 4
Desktop / Server Segment Mobile
 
 

CPU Cores and Base Frequency

The Intel Xeon D-1653N has 8 CPU cores and can calculate 16 threads in parallel.
The clock frequency of the Intel Xeon D-1653N is 2.8 GHz
and turbo frequency for one core is 3.2 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 655 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.12 GHz.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
normal Core architecture hybrid (big.LITTLE)
16 Threads 8
Yes Hyperthreading No
3.0 GHz Turbo Frequency (all cores) None
None None 1.7 GHz
3.2 GHz Turbo Frequency (1 core) None
2.8 GHz Frequency None
None None 4x Cortex-A53
8x Cores None
No Overclocking No
None None 4x Cortex-A53
8 CPU Cores 8
None None 2.12 GHz
 
 

Internal Graphics

The Intel Xeon D-1653N does not have integrated graphics.
The HiSilicon Kirin 655 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 655 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Execution units 2
-- GPU (Turbo) --
-- Max. displays --
-- Generation Midgard 4
-- Direct X 11
-- Release date Q4/2015
-- Technology 28 nm
-- Shaders 32
GPU name ARM Mali-T830 MP2
0 bytes Max. GPU Memory 0 bytes
-- GPU frequency 0.9 GHz
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- JPEG Decode / Encode
-- VC-1 No
-- AVC No
-- VP8 Decode / Encode
-- VP9 No
-- h264 Decode / Encode
-- AV1 No
-- h265 / HEVC (10 bit) Decode
-- h265 / HEVC (8 bit) Decode / Encode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 38.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
38.4 GB/s Bandwidth --
DDR4-2400 Memory type LPDDR3-933
128.0 GB Max. Memory 0 bytes
Yes ECC No
2 Memory channels 2
pci PCIe pci
Yes AES-NI No
 
 

Thermal Management

The processor has a thermal design power (TDP) of 65 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
65 W TDP (PL1 / PBP) None
-- Tjunction max --
 
 

Technical details

The Intel Xeon D-1653N is manufactured using a 14 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 655 is manufactured using a 16 nm process.
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
BGA 1667 Socket
VT-x, VT-x EPT, VT-d Virtualization None
Q2/2019 Release date Q2/2016
-- Part Number --
Technical data sheet Documents Technical data sheet
14 nm Technology 16 nm
Windows 10, Linux Operating systems Android
800 $ Release price --
Monolithic Chip design Chiplet
0 bytes L3-Cache 0 bytes
12.0 MB L2-Cache 0 bytes
Hewitt Lake Architecture Cortex-A53 / Cortex-A53
SSE4.1, SSE4.2, AVX2 ISA extensions