HiSilicon Kirin 9000E vs Intel Pentium 2030M

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 9000E or HiSilicon Kirin 9000E – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 9000E features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q4/2020 and belongs to the 9 generation of the HiSilicon Kirin series.
The Intel Pentium 2030M features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q1/2013 and belongs to the 4 generation of the Intel Pentium series.
To use the Intel Pentium 2030M, you'll need a motherboard with a PGA 988 socket.
HiSilicon Kirin 9000 Group Intel Pentium 2000
9 Generation 4
Mobile Segment Mobile
HiSilicon Kirin 9000E Name Intel Pentium 2030M
HiSilicon Kirin Family Intel Pentium
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 9000E has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 3.13 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The Intel Pentium 2030M has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Pentium 2030M is 2.5 GHz
4x Cortex-A55 Cores C None
8 Threads 2
2.54 GHz B-Core Frequency None
None None 2x
8 CPU Cores 2
hybrid (Prime / big.LITTLE) Core architecture normal
1x Cortex-A77 Cores A None
No Hyperthreading No
3.13 GHz A-Core Frequency None
No Overclocking No
3x Cortex-A77 Cores B None
2.05 GHz C-Core Frequency None
None None 2.5 GHz
 
 

Internal Graphics

The HiSilicon Kirin 9000E has integrated graphics, called iGPU for short.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Pentium 2030M has integrated graphics, called iGPU for short.
Specifically, the Intel Pentium 2030M uses the Intel HD Graphics (Ivy Bridge GT1), which has 48 texture shaders
and 6 execution units.
-- Shaders 48
-- Release date Q4/2012
-- Technology 22 nm
-- Direct X 11.0
0 bytes Max. GPU Memory 2.0 GB
-- Max. displays --
-- Execution units 6
0.76 GHz GPU frequency 0.65 GHz
-- Generation 7
-- GPU (Turbo) 1.1 GHz
ARM Mali-G78 MP22 GPU name Intel HD Graphics (Ivy Bridge GT1)
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP8 No
-- VC-1 Decode
-- JPEG Decode
-- AV1 No
-- h265 / HEVC (8 bit) No
-- AVC Decode / Encode
-- h264 Decode / Encode
-- VP9 No
-- h265 / HEVC (10 bit) No
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 32.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 25.6 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
pci PCIe pci
No AES-NI Yes
LPDDR4X-2133, LPDDR5-2750 Memory type DDR3L-1600, DDR3L-1333, DDR3-1333, DDR3-1600
No ECC No
0 bytes Max. Memory 32.0 GB
4 Memory channels 2
-- Bandwidth 25.6 GB/s
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 35 W watts.
None TDP (PL1 / PBP) 35 W
-- Tjunction max 90 °C
 
 

Technical details

The HiSilicon Kirin 9000E is manufactured using a 5 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Pentium 2030M is manufactured using a 22 nm process.
In total, this processor boasts a generous 2.0 MB cache.
Q4/2020 Release date Q1/2013
None Virtualization VT-x, VT-x EPT, VT-d
ISA extensions SSE4.1, SSE4.2
5 nm Technology 22 nm
Chiplet Chip design Monolithic
-- Release price --
Cortex-A77 / Cortex-A55 Architecture Ivy Bridge U
0 bytes L3-Cache 2.0 MB
Android Operating systems Windows 10, Linux
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
-- Part Number --
Socket PGA 988
0 bytes L2-Cache 0 bytes