Intel Atom C5310 vs Intel Core2 Duo T5870
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CPU comparison with benchmarks |
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Intel Atom C5310 or Intel Atom C5310 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Atom C5310 features 4 processor cores and has the capability to manage 4 threads concurrently. It was released in Q2/2022 and belongs to the 6 generation of the Intel Atom series. To use the Intel Atom C5310, you'll need a motherboard with a BGA 2106 socket. The Intel Core2 Duo T5870 features 2 processor cores and has the capability to manage 2 threads concurrently. It belongs to the 1 generation of the Intel Celeron series. |
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| Intel Atom | Family | Intel Celeron |
| Desktop / Server | Segment | Mobile |
| Intel Atom C5310 | Name | Intel Core2 Duo T5870 |
| Intel Atom C5000 | Group | Intel Core 2 Duo T5000 |
| 6 | Generation | 1 |
CPU Cores and Base Frequency |
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The Intel Atom C5310 has 4 CPU cores and can calculate 4 threads in parallel.
The clock frequency of the Intel Atom C5310 is 1.6 GHz The Intel Core2 Duo T5870 has 2 CPU cores and can calculate 2 threads in parallel. The clock frequency of the Intel Core2 Duo T5870 is 2.0 GHz |
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| normal | Core architecture | normal |
| 4x | Cores | 2x |
| No | Hyperthreading | No |
| 1.6 GHz | Frequency | 2.0 GHz |
| No | Overclocking | No |
| 4 | Threads | 2 |
| 4 | CPU Cores | 2 |
Internal Graphics |
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The Intel Atom C5310 does not have integrated graphics.
The Intel Core2 Duo T5870 does not have integrated graphics. |
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| -- | GPU (Turbo) | -- |
| -- | Release date | -- |
| -- | Execution units | -- |
| -- | Direct X | -- |
| -- | Max. displays | -- |
| -- | Shaders | -- |
| GPU name | ||
| -- | GPU frequency | -- |
| 0 bytes | Max. GPU Memory | 0 bytes |
| -- | Generation | -- |
| -- | Technology | -- |
Artificial Intelligence and Machine Learning |
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| -- | AI specifications | -- |
| -- | AI hardware | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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| -- | VP8 | -- |
| -- | VP9 | -- |
| -- | AVC | -- |
| -- | h264 | -- |
| -- | JPEG | -- |
| -- | VC-1 | -- |
| -- | AV1 | -- |
| -- | h265 / HEVC (8 bit) | -- |
| -- | h265 / HEVC (10 bit) | -- |
Memory & PCIe |
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The processor supports a maximum memory capacity of 256.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 38.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
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| Yes | AES-NI | No |
| 256.0 GB | Max. Memory | 0 bytes |
| 38.4 GB/s | Bandwidth | -- |
| DDR4-2400 | Memory type | |
| pci | PCIe | pci |
| 2 | Memory channels | -- |
| Yes | ECC | No |
Thermal Management |
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The processor has a thermal design power (TDP) of 32 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself. The processor has a thermal design power (TDP) of 35 W watts. |
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| 32 W | TDP (PL1 / PBP) | 35 W |
| 100 °C | Tjunction max | 100 °C |
Technical details |
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The Intel Atom C5310 is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The Intel Core2 Duo T5870 is manufactured using a 65 nm process. |
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| Technical data sheet | Documents | Technical data sheet |
| Q2/2022 | Release date | -- |
| BGA 2106 | Socket | |
| 9.0 MB | L2-Cache | 2.0 MB |
| 0 bytes | L3-Cache | 0 bytes |
| Windows 10, Linux | Operating systems | |
| x86-64 (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
| -- | Part Number | -- |
| Parker Ridge | Architecture | Merom (Core) |
| VT-x, VT-x EPT, VT-d | Virtualization | VT-x |
| -- | Release price | -- |
| SSE4.1, SSE4.2, Intel QAT | ISA extensions | SSE3, MMX, SSE, SSE2 |
| Monolithic | Chip design | Monolithic |
| 10 nm | Technology | 65 nm |
CPU-Z Benchmark 17 (Multi-Core)
