Intel Core i3-2357M vs AMD E1-1500

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Core i3-2357M or Intel Core i3-2357M – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Core i3-2357M features 2 processor cores and has the capability to manage 4 threads concurrently.
It was released in Q2/2011 and belongs to the 2 generation of the Intel Core i3 series.
To use the Intel Core i3-2357M, you'll need a motherboard with a BGA 1023 socket.
The AMD E1-1500 features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q1/2013 and belongs to the 1 generation of the AMD E series.
To use the AMD E1-1500, you'll need a motherboard with a BGA 413 socket.
Intel Core i3 Family AMD E
Intel Core i3-2357M Name AMD E1-1500
Mobile Segment Mobile
2 Generation 1
Intel Core i 2000M Group AMD E1/E2-1000
 
 

CPU Cores and Base Frequency

The Intel Core i3-2357M has 2 CPU cores and can calculate 4 threads in parallel.
The clock frequency of the Intel Core i3-2357M is 1.3 GHz
The AMD E1-1500 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the AMD E1-1500 is 1.48 GHz
No Overclocking No
2x Cores 2x
normal Core architecture normal
2 CPU Cores 2
1.3 GHz Frequency 1.48 GHz
4 Threads 2
Yes Hyperthreading No
 
 

Internal Graphics

The Intel Core i3-2357M has integrated graphics, called iGPU for short.
Specifically, the Intel Core i3-2357M uses the Intel HD Graphics 3000, which has 96 texture shaders
and 12 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The AMD E1-1500 has integrated graphics, called iGPU for short.
Specifically, the AMD E1-1500 uses the AMD Radeon HD 7310, which has 80 texture shaders
and 1 execution units.
-- Max. displays --
Intel HD Graphics 3000 GPU name AMD Radeon HD 7310
96 Shaders 80
10.1 Direct X 11
Q1/2011 Release date Q2/2012
6 Generation 4
12 Execution units 1
2.0 GB Max. GPU Memory 1.0 GB
32 nm Technology 40 nm
0.35 GHz GPU frequency 0.53 GHz
0.95 GHz GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
No h265 / HEVC (10 bit) No
No VP9 No
No VP8 No
Decode / Encode AVC Decode
No h265 / HEVC (8 bit) No
Decode / Encode h264 Decode
No JPEG Decode / Encode
Decode VC-1 Decode
No AV1 No
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 16.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 21.3 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
Yes AES-NI Yes
DDR3-1333 Memory type DDR3-1066
2 Memory channels 1
Yes ECC No
pci PCIe pci
21.3 GB/s Bandwidth --
16.0 GB Max. Memory 0 bytes
 
 

Thermal Management

The processor has a thermal design power (TDP) of 17 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 18 W watts.
100 °C Tjunction max --
17 W TDP (PL1 / PBP) 18 W
 
 

Technical details

The Intel Core i3-2357M is manufactured using a 32 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 3.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The AMD E1-1500 is manufactured using a 32 nm process.
In total, this processor boasts a generous 1.0 MB cache.
BGA 1023 Socket BGA 413
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
Windows 10, Linux Operating systems
-- Release price --
Q2/2011 Release date Q1/2013
Technical data sheet Documents Technical data sheet
Monolithic Chip design --
Sandy Bridge H Architecture Zacate (Bobcat)
3.0 MB L3-Cache 1.0 MB
SSE4.1, SSE4.2, AVX ISA extensions SSE4a, SSE4.1, SSE4.2, AVX
-- Part Number --
0 bytes L2-Cache 0 bytes
32 nm Technology 32 nm
VT-x, VT-x EPT Virtualization AMD-V