Intel Core i7-8700K vs HiSilicon Kirin 990 4G

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Core i7-8700K or Intel Core i7-8700K – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Core i7-8700K features 6 processor cores and has the capability to manage 12 threads concurrently.
It was released in Q4/2017 and belongs to the 8 generation of the Intel Core i7 series.
To use the Intel Core i7-8700K, you'll need a motherboard with a LGA 1151-2 socket.
The HiSilicon Kirin 990 4G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2019 and belongs to the 8 generation of the HiSilicon Kirin series.
Intel Core i 8000 Group HiSilicon Kirin 990
8 Generation 8
Intel Core i7-8700K Name HiSilicon Kirin 990 4G
Desktop / Server Segment Mobile
Intel Core i7 Family HiSilicon Kirin
 
 

CPU Cores and Base Frequency

The Intel Core i7-8700K has 6 CPU cores and can calculate 12 threads in parallel.
The clock frequency of the Intel Core i7-8700K is 3.7 GHz
and turbo frequency for one core is 4.7 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 990 4G has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.86 GHz.
None None 2.86 GHz
4.3 GHz Turbo Frequency (all cores) None
None None 2.09 GHz
4.7 GHz Turbo Frequency (1 core) None
normal Core architecture hybrid (Prime / big.LITTLE)
3.7 GHz Frequency None
6 CPU Cores 8
Yes Overclocking No
None None 2x Cortex-A76
None None 4x Cortex-A55
Yes Hyperthreading No
None None 1.86 GHz
None None 2x Cortex-A76
6x Cores None
12 Threads 8
 
 

Internal Graphics

The Intel Core i7-8700K has integrated graphics, called iGPU for short.
Specifically, the Intel Core i7-8700K uses the Intel UHD Graphics 630, which has 192 texture shaders
and 24 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The HiSilicon Kirin 990 4G has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 990 4G uses the ARM Mali-G76 MP16, which has 256 texture shaders
and 16 execution units.
1.2 GHz GPU (Turbo) --
14 nm Technology 7 nm
12 Direct X 12
64.0 GB Max. GPU Memory 4.0 GB
24 Execution units 16
Q4/2017 Release date Q3/2018
Intel UHD Graphics 630 GPU name ARM Mali-G76 MP16
192 Shaders 256
0.35 GHz GPU frequency 0.6 GHz
9.5 Generation Bifrost 3
-- Max. displays --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny
-- AI hardware HUAWEI HiAI 2.0
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode h265 / HEVC (8 bit) Decode / Encode
Decode / Encode VP9 Decode / Encode
Decode / Encode VP8 Decode / Encode
Decode VC-1 Decode / Encode
Decode / Encode JPEG Decode / Encode
Decode / Encode h264 Decode / Encode
Decode / Encode h265 / HEVC (10 bit) Decode / Encode
Decode / Encode AVC Decode / Encode
No AV1 No
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 42.7 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
DDR4-2666 Memory type LPDDR4X-2133
42.7 GB/s Bandwidth --
Yes AES-NI No
No ECC No
pci PCIe pci
128.0 GB Max. Memory 8.0 GB
2 Memory channels 4
 
 

Thermal Management

The processor has a thermal design power (TDP) of 95 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 6 W watts.
95 W TDP (PL1 / PBP) 6 W
-- Tjunction max --
 
 

Technical details

The Intel Core i7-8700K is manufactured using a 14 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 12.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 990 4G is manufactured using a 7 nm process.
In total, this processor boasts a generous 2.0 MB cache.
VT-x, VT-x EPT, VT-d Virtualization None
14 nm Technology 7 nm
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
SSE4.1, SSE4.2, AVX2 ISA extensions
-- Part Number --
Monolithic Chip design Chiplet
Q4/2017 Release date Q3/2019
370 $ Release price --
0 bytes L2-Cache 0 bytes
Technical data sheet Documents Technical data sheet
12.0 MB L3-Cache 2.0 MB
LGA 1151-2 Socket
Windows 10, Linux, Windows 11 Operating systems Android
Coffee Lake S Architecture Cortex-A76 / Cortex-A55
 
 

Benchmarks

Geekbench 6 (Multi-Core)

Intel Core i7-8700K
6C 12T @ 3.7 GHz
6750
6750
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz
3244
3244

Geekbench 5, 64bit (Multi-Core)

Intel Core i7-8700K
6C 12T @ 3.7 GHz
6693
6693
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz
2855
2855

Geekbench 6 (Single-Core)

Intel Core i7-8700K
6C 12T @ 3.7 GHz
1486
1486
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz
996
996