Intel Xeon D-2786NTE vs HiSilicon Kirin 659

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Xeon D-2786NTE or Intel Xeon D-2786NTE – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon D-2786NTE features 18 processor cores and has the capability to manage 36 threads concurrently.
It was released in Q1/2022 and belongs to the 4 generation of the Intel Xeon D series.
To use the Intel Xeon D-2786NTE, you'll need a motherboard with a BGA 2579 socket.
The HiSilicon Kirin 659 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
Intel Xeon D-2700 Group HiSilicon Kirin 650
4 Generation 4
Intel Xeon D-2786NTE Name HiSilicon Kirin 659
Desktop / Server Segment Mobile
Intel Xeon D Family HiSilicon Kirin
 
 

CPU Cores and Base Frequency

The Intel Xeon D-2786NTE has 18 CPU cores and can calculate 36 threads in parallel.
The clock frequency of the Intel Xeon D-2786NTE is 2.1 GHz
and turbo frequency for one core is 3.1 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 659 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.36 GHz.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
None None 2.36 GHz
None None 1.7 GHz
3.1 GHz Turbo Frequency (1 core) None
normal Core architecture hybrid (big.LITTLE)
2.1 GHz Frequency None
18 CPU Cores 8
No Overclocking No
None None 4x Cortex-A53
Yes Hyperthreading No
None None 4x Cortex-A53
18x Sunny Cove Cores None
36 Threads 8
 
 

Internal Graphics

The Intel Xeon D-2786NTE does not have integrated graphics.
The HiSilicon Kirin 659 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 659 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- GPU (Turbo) --
-- Technology 28 nm
-- Direct X 11
0 bytes Max. GPU Memory 0 bytes
-- Execution units 2
-- Release date Q4/2015
GPU name ARM Mali-T830 MP2
-- Shaders 32
-- GPU frequency 0.9 GHz
-- Generation Midgard 4
-- Max. displays --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- h265 / HEVC (8 bit) Decode / Encode
-- VP9 No
-- VP8 Decode / Encode
-- VC-1 No
-- JPEG Decode / Encode
-- h264 Decode / Encode
-- h265 / HEVC (10 bit) Decode
-- AVC No
-- AV1 No
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 1.0 TB distributed across 4 memory channels. It offers a peak memory bandwidth of 93.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
DDR4-2933 Memory type LPDDR3-933
93.8 GB/s Bandwidth --
Yes AES-NI No
Yes ECC No
pci PCIe pci
1.0 TB Max. Memory 0 bytes
4 Memory channels 2
 
 

Thermal Management

The processor has a thermal design power (TDP) of 118 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
118 W TDP (PL1 / PBP) None
-- Tjunction max --
 
 

Technical details

The Intel Xeon D-2786NTE is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 659 is manufactured using a 16 nm process.
VT-x, VT-x EPT, VT-d Virtualization None
10 nm Technology 16 nm
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
SSE4.1, SSE4.2, AVX2, AVX-512 ISA extensions
-- Part Number --
Monolithic Chip design Chiplet
Q1/2022 Release date Q2/2016
2141 $ Release price --
27.5 MB L2-Cache 0 bytes
Technical data sheet Documents Technical data sheet
0 bytes L3-Cache 0 bytes
BGA 2579 Socket
Windows 10, Linux Operating systems Android
Ice Lake Architecture Cortex-A53 / Cortex-A53