HiSilicon Kirin 659 Benchmark, Test and specs

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CPU lineage

The HiSilicon Kirin 659 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
Name: HiSilicon Kirin 659
Family: HiSilicon Kirin
Group: HiSilicon Kirin 650
Segment: Mobile
Generation: 4

CPU Cores and Base Frequency

The HiSilicon Kirin 659 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.36 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
CPU Cores: 8
Threads: 8
Cores A: 4x Cortex-A53
Cores B: 4x Cortex-A53
Core architecture: hybrid (big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 2.36 GHz
B-Core Frequency: 1.7 GHz

Internal Graphics

The HiSilicon Kirin 659 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 659 uses the ARM Mali-T830 MP2, which has 32 texture shaders and 2 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: ARM Mali-T830 MP2
GPU frequency: 0.9 GHz
GPU (Turbo): --
Execution units: 2
Shaders: 32
Max. GPU Memory: 0 bytes
Max. displays: --
Generation: Midgard 4
Direct X: 11
Technology: 28 nm
Release date: Q4/2015

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode
h264: Decode / Encode
VP8: Decode / Encode
VP9: No
AV1: No
AVC: No
VC-1: No
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR3-933
Max. Memory: 0 bytes
Memory channels: 2
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): None
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The HiSilicon Kirin 659 is manufactured using a 16 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 16 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 0 bytes
Architecture: Cortex-A53 / Cortex-A53
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv8-A64 (64 bit)
ISA extensions:
Release date: Q2/2016
Release price: --
Part Number: --
Documents: Technical data sheet
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Benchmarks

Geekbench 5, 64bit (Multi-Core)

Intel Celeron N4020
2C 2T @ 1.1 GHz
896
896
Intel Pentium Gold 4415Y
2C 4T @ 1.7 GHz
893
893
HiSilicon Kirin 659
8C 8T @ 2.36 GHz
893
893
Intel Pentium Gold 4415Y
2C 4T @ 1.7 GHz
893
893
MediaTek Helio G35
NoneC NoneT @ --
892
892

Geekbench 5, 64bit (Single-Core)

Intel Celeron N2815
2C 2T @ 1.86 GHz
197
197
Intel Celeron N2806
2C 2T @ 1.6 GHz
196
196
HiSilicon Kirin 659
8C 8T @ 2.36 GHz
193
193
AMD Turion 64 MK-36
NoneC NoneT @ --
191
191
Intel Celeron N2810
2C 2T @ 2.0 GHz
189
189

All benchmarks for HiSilicon Kirin 659