Intel Xeon W-2170B vs AMD Ryzen 9 3900

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Xeon W-2170B or Intel Xeon W-2170B – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon W-2170B features 14 processor cores and has the capability to manage 28 threads concurrently.
It was released in Q3/2017 and belongs to the 6 generation of the Intel Xeon W series.
To use the Intel Xeon W-2170B, you'll need a motherboard with a LGA 2066 socket.
The AMD Ryzen 9 3900 features 12 processor cores and has the capability to manage 24 threads concurrently.
It was released in Q3/2019 and belongs to the 3 generation of the AMD Ryzen 9 series.
To use the AMD Ryzen 9 3900, you'll need a motherboard with a AM4 (PGA 1331) socket.
Intel Xeon W-2100/3100 Group AMD Ryzen 3000
6 Generation 3
Intel Xeon W-2170B Name AMD Ryzen 9 3900
Desktop / Server Segment Desktop / Server
Intel Xeon W Family AMD Ryzen 9
 
 

CPU Cores and Base Frequency

The Intel Xeon W-2170B has 14 CPU cores and can calculate 28 threads in parallel.
The clock frequency of the Intel Xeon W-2170B is 2.5 GHz
and turbo frequency for one core is 4.3 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The AMD Ryzen 9 3900 has 12 CPU cores and can calculate 24 threads in parallel.
The clock frequency of the AMD Ryzen 9 3900 is 3.1 GHz
4.3 GHz Turbo Frequency (1 core) 4.3 GHz
normal Core architecture normal
2.5 GHz Frequency 3.1 GHz
14 CPU Cores 12
No Overclocking Yes
Yes Hyperthreading Yes
14x Cores 12x
28 Threads 24
 
 

Internal Graphics

The Intel Xeon W-2170B does not have integrated graphics.
The AMD Ryzen 9 3900 does not have integrated graphics.
-- GPU (Turbo) --
-- Technology --
-- Direct X --
0 bytes Max. GPU Memory 0 bytes
-- Execution units --
-- Release date --
GPU name
-- Shaders --
-- GPU frequency --
-- Generation --
-- Max. displays --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- h265 / HEVC (8 bit) --
-- VP9 --
-- VP8 --
-- VC-1 --
-- JPEG --
-- h264 --
-- h265 / HEVC (10 bit) --
-- AVC --
-- AV1 --
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 512.0 GB distributed across 4 memory channels. It offers a peak memory bandwidth of 85.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
DDR4-2666 Memory type DDR4-3200
85.4 GB/s Bandwidth 51.2 GB/s
Yes AES-NI Yes
Yes ECC No
pci PCIe pci
512.0 GB Max. Memory 128.0 GB
4 Memory channels 2
 
 

Thermal Management

The processor has a thermal design power (TDP) of 140 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 65 W watts.
140 W TDP (PL1 / PBP) 65 W
-- Tjunction max 95 °C
 
 

Technical details

The Intel Xeon W-2170B is manufactured using a 14 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 19.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The AMD Ryzen 9 3900 is manufactured using a 7 nm process.
In total, this processor boasts a generous 64.0 MB cache.
VT-x, VT-x EPT, VT-d Virtualization AMD-V, SVM
14 nm Technology 7 nm
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
SSE4.1, SSE4.2, AVX2, AVX-512 ISA extensions SSE4a, SSE4.1, SSE4.2, FMA3, AVX2
-- Part Number --
Monolithic Chip design Chiplet
Q3/2017 Release date Q3/2019
-- Release price 485 $
0 bytes L2-Cache 0 bytes
Technical data sheet Documents Technical data sheet
19.0 MB L3-Cache 64.0 MB
LGA 2066 Socket AM4 (PGA 1331)
Windows 10, Linux Operating systems Windows 10, Linux, Windows 11
Skylake W Architecture Matisse (Zen 2)