Qualcomm Snapdragon 430 vs Intel Xeon W-1370P

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CPU comparison with benchmarks

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CPU lineage

Qualcomm Snapdragon 430 or Qualcomm Snapdragon 430 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon W-1370P features 8 processor cores and has the capability to manage 16 threads concurrently.
It was released in Q2/2021 and belongs to the 11 generation of the Intel Xeon W series.
To use the Intel Xeon W-1370P, you'll need a motherboard with a LGA 1200 socket.
Family Intel Xeon W
Qualcomm Snapdragon 430 Name Intel Xeon W-1370P
-- Segment Desktop / Server
Group Intel Xeon W-1300
-- Generation 11
 
 

CPU Cores and Base Frequency

The Intel Xeon W-1370P has 8 CPU cores and can calculate 16 threads in parallel.
The clock frequency of the Intel Xeon W-1370P is 3.6 GHz
and turbo frequency for one core is 5.2 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
-- CPU Cores 8
None None 4.4 GHz
-- Core architecture normal
No Overclocking No
None None 5.2 GHz
None None 3.6 GHz
-- Threads 16
No Hyperthreading Yes
None None 8x
 
 

Internal Graphics

The Qualcomm Snapdragon 430 does not have integrated graphics.
The Intel Xeon W-1370P has integrated graphics, called iGPU for short.
Specifically, the Intel Xeon W-1370P uses the Intel UHD Graphics P750, which has 256 texture shaders
and 64 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Max. displays --
-- Direct X 12
-- GPU (Turbo) 1.3 GHz
-- Shaders 256
0 bytes Max. GPU Memory 32.0 GB
-- GPU frequency 0.35 GHz
GPU name Intel UHD Graphics P750
-- Release date Q2/2021
-- Technology 14 nm
-- Generation 12
-- Execution units 64
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP9 Decode / Encode
-- AVC Decode / Encode
-- JPEG Decode / Encode
-- VC-1 Decode
-- h265 / HEVC (8 bit) Decode / Encode
-- VP8 Decode
-- h264 Decode / Encode
-- h265 / HEVC (10 bit) Decode / Encode
-- AV1 Decode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
No ECC Yes
0 bytes Max. Memory 128.0 GB
-- Bandwidth 51.2 GB/s
pci PCIe pci
Memory type DDR4-3200
-- Memory channels 2
No AES-NI Yes
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 125 W watts.
None TDP (PL1 / PBP) 125 W
-- Tjunction max 100 °C
None TDP down 95 W
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Xeon W-1370P is manufactured using a 14 nm process.
0 bytes L2-Cache 16.0 MB
Technical data sheet Documents Technical data sheet
-- Architecture Rocket Lake S
-- Release price 428 $
-- Chip design Monolithic
0 bytes L3-Cache 0 bytes
ISA extensions SSE4.1, SSE4.2, AVX2, AVX-512
-- Release date Q2/2021
Virtualization VT-x, VT-x EPT, VT-d
Operating systems Windows 10, Linux
-- Part Number --
Socket LGA 1200
-- Technology 14 nm
Instruction set (ISA) x86-64 (64 bit)
 
 

Benchmarks