Qualcomm Snapdragon 430 vs Intel Xeon W-1370P

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CPU comparison with benchmarks

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CPU lineage

Qualcomm Snapdragon 430 or Qualcomm Snapdragon 430 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon W-1370P features 8 processor cores and has the capability to manage 16 threads concurrently.
It was released in Q2/2021 and belongs to the 11 generation of the Intel Xeon W series.
To use the Intel Xeon W-1370P, you'll need a motherboard with a LGA 1200 socket.
-- Segment Desktop / Server
Group Intel Xeon W-1300
Family Intel Xeon W
-- Generation 11
Qualcomm Snapdragon 430 Name Intel Xeon W-1370P
 
 

CPU Cores and Base Frequency

The Intel Xeon W-1370P has 8 CPU cores and can calculate 16 threads in parallel.
The clock frequency of the Intel Xeon W-1370P is 3.6 GHz
and turbo frequency for one core is 5.2 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
None None 8x
-- Core architecture normal
No Hyperthreading Yes
-- Threads 16
None None 5.2 GHz
No Overclocking No
None None 3.6 GHz
-- CPU Cores 8
None None 4.4 GHz
 
 

Internal Graphics

The Qualcomm Snapdragon 430 does not have integrated graphics.
The Intel Xeon W-1370P has integrated graphics, called iGPU for short.
Specifically, the Intel Xeon W-1370P uses the Intel UHD Graphics P750, which has 256 texture shaders
and 64 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Direct X 12
0 bytes Max. GPU Memory 32.0 GB
-- Execution units 64
-- Generation 12
-- GPU (Turbo) 1.3 GHz
-- Release date Q2/2021
GPU name Intel UHD Graphics P750
-- Shaders 256
-- Max. displays --
-- Technology 14 nm
-- GPU frequency 0.35 GHz
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- h264 Decode / Encode
-- h265 / HEVC (10 bit) Decode / Encode
-- AVC Decode / Encode
-- VC-1 Decode
-- h265 / HEVC (8 bit) Decode / Encode
-- VP9 Decode / Encode
-- AV1 Decode
-- JPEG Decode / Encode
-- VP8 Decode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
No ECC Yes
0 bytes Max. Memory 128.0 GB
-- Memory channels 2
No AES-NI Yes
Memory type DDR4-3200
pci PCIe pci
-- Bandwidth 51.2 GB/s
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 125 W watts.
-- Tjunction max 100 °C
None TDP down 95 W
None TDP (PL1 / PBP) 125 W
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Xeon W-1370P is manufactured using a 14 nm process.
-- Part Number --
Instruction set (ISA) x86-64 (64 bit)
0 bytes L2-Cache 16.0 MB
-- Chip design Monolithic
-- Release price 428 $
Operating systems Windows 10, Linux
Virtualization VT-x, VT-x EPT, VT-d
0 bytes L3-Cache 0 bytes
-- Release date Q2/2021
Technical data sheet Documents Technical data sheet
Socket LGA 1200
-- Architecture Rocket Lake S
-- Technology 14 nm
ISA extensions SSE4.1, SSE4.2, AVX2, AVX-512
 
 

Benchmarks