Qualcomm Snapdragon 430 vs Intel Xeon W-1370P

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CPU comparison with benchmarks

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CPU lineage

Qualcomm Snapdragon 430 or Qualcomm Snapdragon 430 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon W-1370P features 8 processor cores and has the capability to manage 16 threads concurrently.
It was released in Q2/2021 and belongs to the 11 generation of the Intel Xeon W series.
To use the Intel Xeon W-1370P, you'll need a motherboard with a LGA 1200 socket.
Family Intel Xeon W
-- Segment Desktop / Server
Group Intel Xeon W-1300
-- Generation 11
Qualcomm Snapdragon 430 Name Intel Xeon W-1370P
 
 

CPU Cores and Base Frequency

The Intel Xeon W-1370P has 8 CPU cores and can calculate 16 threads in parallel.
The clock frequency of the Intel Xeon W-1370P is 3.6 GHz
and turbo frequency for one core is 5.2 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
None None 4.4 GHz
-- Threads 16
None None 8x
None None 3.6 GHz
No Overclocking No
-- Core architecture normal
No Hyperthreading Yes
-- CPU Cores 8
None None 5.2 GHz
 
 

Internal Graphics

The Qualcomm Snapdragon 430 does not have integrated graphics.
The Intel Xeon W-1370P has integrated graphics, called iGPU for short.
Specifically, the Intel Xeon W-1370P uses the Intel UHD Graphics P750, which has 256 texture shaders
and 64 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Execution units 64
-- Technology 14 nm
-- Direct X 12
-- Release date Q2/2021
-- Shaders 256
-- GPU frequency 0.35 GHz
-- Max. displays --
GPU name Intel UHD Graphics P750
-- Generation 12
-- GPU (Turbo) 1.3 GHz
0 bytes Max. GPU Memory 32.0 GB
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- AVC Decode / Encode
-- h265 / HEVC (8 bit) Decode / Encode
-- h265 / HEVC (10 bit) Decode / Encode
-- VP9 Decode / Encode
-- AV1 Decode
-- JPEG Decode / Encode
-- h264 Decode / Encode
-- VP8 Decode
-- VC-1 Decode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
No ECC Yes
pci PCIe pci
-- Memory channels 2
-- Bandwidth 51.2 GB/s
Memory type DDR4-3200
No AES-NI Yes
0 bytes Max. Memory 128.0 GB
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 125 W watts.
None TDP (PL1 / PBP) 125 W
None TDP down 95 W
-- Tjunction max 100 °C
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Xeon W-1370P is manufactured using a 14 nm process.
Operating systems Windows 10, Linux
-- Technology 14 nm
-- Chip design Monolithic
ISA extensions SSE4.1, SSE4.2, AVX2, AVX-512
-- Part Number --
-- Release date Q2/2021
-- Architecture Rocket Lake S
Technical data sheet Documents Technical data sheet
Virtualization VT-x, VT-x EPT, VT-d
Socket LGA 1200
0 bytes L2-Cache 16.0 MB
Instruction set (ISA) x86-64 (64 bit)
0 bytes L3-Cache 0 bytes
-- Release price 428 $
 
 

Benchmarks