CPU comparison with benchmarks |
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CPU lineage |
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Qualcomm Snapdragon 675 or Qualcomm Snapdragon 675 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 675 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q1/2019 and belongs to the 7 generation of the Qualcomm Snapdragon series. The Intel Celeron T1700 features 2 processor cores and has the capability to manage 2 threads concurrently. It was released in Q4/2008 and belongs to the 1 generation of the Intel Celeron series. To use the Intel Celeron T1700, you'll need a motherboard with a PGA 478 socket. |
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| Qualcomm Snapdragon 675/678 | Group | Intel Celeron T1000 |
| 7 | Generation | 1 |
| Qualcomm Snapdragon 675 | Name | Intel Celeron T1700 |
| Mobile | Segment | Mobile |
| Qualcomm Snapdragon | Family | Intel Celeron |
CPU Cores and Base Frequency |
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The Qualcomm Snapdragon 675 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.0 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices. The Intel Celeron T1700 has 2 CPU cores and can calculate 2 threads in parallel. The clock frequency of the Intel Celeron T1700 is 1.83 GHz |
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| 1.7 GHz | B-Core Frequency | None |
| None | None | 2x |
| hybrid (big.LITTLE) | Core architecture | normal |
| 2x Kryo 460 Gold | Cores A | None |
| 8 | CPU Cores | 2 |
| No | Overclocking | No |
| None | None | 1.83 GHz |
| No | Hyperthreading | No |
| 2.0 GHz | A-Core Frequency | None |
| 6x Kryo 460 Silver | Cores B | None |
| 8 | Threads | 2 |
Internal Graphics |
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The Qualcomm Snapdragon 675 has integrated graphics, called iGPU for short.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die. The Intel Celeron T1700 does not have integrated graphics. |
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| 0.85 GHz | GPU (Turbo) | -- |
| 11 nm | Technology | -- |
| 12.1 | Direct X | -- |
| 0 bytes | Max. GPU Memory | 0 bytes |
| -- | Execution units | -- |
| Q4/2015 | Release date | -- |
| Qualcomm Adreno 612 | GPU name | |
| -- | Shaders | -- |
| 0.85 GHz | GPU frequency | -- |
| 6 | Generation | -- |
| -- | Max. displays | -- |
Artificial Intelligence and Machine Learning |
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| -- | AI specifications | -- |
| -- | AI hardware | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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| Decode | h265 / HEVC (8 bit) | -- |
| Decode | VP9 | -- |
| Decode | VP8 | -- |
| Decode | VC-1 | -- |
| Decode / Encode | JPEG | -- |
| Decode / Encode | h264 | -- |
| Decode | h265 / HEVC (10 bit) | -- |
| Decode | AVC | -- |
| No | AV1 | -- |
Memory & PCIe |
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| LPDDR4X-1866 | Memory type | |
| -- | Bandwidth | -- |
| No | AES-NI | No |
| No | ECC | No |
| pci | PCIe | pci |
| 0 bytes | Max. Memory | 0 bytes |
| 2 | Memory channels | -- |
Thermal Management |
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TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 35 W watts. |
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| None | TDP (PL1 / PBP) | 35 W |
| -- | Tjunction max | 100 °C |
Technical details |
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The Qualcomm Snapdragon 675 is manufactured using a 11 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The Intel Celeron T1700 is manufactured using a 65 nm process. |
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| None | Virtualization | - |
| 11 nm | Technology | 65 nm |
| ARMv8-A64 (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
| ISA extensions | SSE3, MMX, SSSE3, SSE, SSE2 | |
| SM6150 | Part Number | -- |
| Chiplet | Chip design | Monolithic |
| Q1/2019 | Release date | Q4/2008 |
| -- | Release price | -- |
| 0 bytes | L2-Cache | 1.0 MB |
| Technical data sheet | Documents | Technical data sheet |
| 0 bytes | L3-Cache | 0 bytes |
| Socket | PGA 478 | |
| Android | Operating systems | Windows 10, Linux |
| Kryo 460 | Architecture | Montevina (Merom) |