Qualcomm Snapdragon 780G vs Intel Xeon D-2775TE

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 780G or Qualcomm Snapdragon 780G – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 780G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2021 and belongs to the 4 generation of the Qualcomm Snapdragon series.
The Intel Xeon D-2775TE features 16 processor cores and has the capability to manage 32 threads concurrently.
It was released in Q1/2022 and belongs to the 4 generation of the Intel Xeon D series.
To use the Intel Xeon D-2775TE, you'll need a motherboard with a BGA 2579 socket.
Mobile Segment Desktop / Server
Qualcomm Snapdragon 780G Name Intel Xeon D-2775TE
Qualcomm Snapdragon Family Intel Xeon D
4 Generation 4
Qualcomm Snapdragon 780 Group Intel Xeon D-2700
 
 

CPU Cores and Base Frequency

The Qualcomm Snapdragon 780G has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The Intel Xeon D-2775TE has 16 CPU cores and can calculate 32 threads in parallel.
The clock frequency of the Intel Xeon D-2775TE is 2.0 GHz
and turbo frequency for one core is 3.1 GHz.
4x Kryo 670 Silver Cores C None
None None 3.1 GHz
1.9 GHz C-Core Frequency None
2.2 GHz B-Core Frequency None
2.4 GHz A-Core Frequency None
3x Kryo 670 Gold Cores B None
1x Kryo 670 Prime Cores A None
No Overclocking No
hybrid (Prime / big.LITTLE) Core architecture normal
None None 2.0 GHz
8 Threads 32
No Hyperthreading Yes
8 CPU Cores 16
None None 16x Sunny Cove
 
 

Internal Graphics

The Qualcomm Snapdragon 780G has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 780G uses the Qualcomm Adreno 642, which has 384 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Xeon D-2775TE does not have integrated graphics.
-- GPU frequency --
Q2/2021 Release date --
12.0 Direct X --
Qualcomm Adreno 642 GPU name
5 nm Technology --
-- Max. displays --
384 Shaders --
4.0 GB Max. GPU Memory 0 bytes
4 Execution units --
5 Generation --
-- GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode AVC --
Decode VC-1 --
Decode / Encode VP9 --
Decode / Encode h265 / HEVC (10 bit) --
Decode / Encode h264 --
Decode / Encode VP8 --
Decode / Encode h265 / HEVC (8 bit) --
Decode / Encode JPEG --
No AV1 --
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 1.0 TB distributed across 4 memory channels. It offers a peak memory bandwidth of 93.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
2 Memory channels 4
16.0 GB Max. Memory 1.0 TB
pci PCIe pci
No AES-NI Yes
No ECC Yes
-- Bandwidth 93.8 GB/s
LPDDR4X-2133 Memory type DDR4-2933
 
 

Thermal Management

The processor has a thermal design power (TDP) of 5 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 100 W watts.
-- Tjunction max --
5 W TDP (PL1 / PBP) 100 W
 
 

Technical details

The Qualcomm Snapdragon 780G is manufactured using a 5 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Xeon D-2775TE is manufactured using a 10 nm process.
Q2/2021 Release date Q1/2022
SM7350 Part Number --
0 bytes L2-Cache 25.0 MB
None Virtualization VT-x, VT-x EPT, VT-d
ISA extensions SSE4.1, SSE4.2, AVX2, AVX-512
Chiplet Chip design Monolithic
Kryo 670 Architecture Ice Lake
5 nm Technology 10 nm
Socket BGA 2579
Android Operating systems Windows 10, Linux
-- Release price 1784 $
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
2.0 MB L3-Cache 0 bytes