Qualcomm Snapdragon 888 vs HiSilicon Kirin 970

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 888 or Qualcomm Snapdragon 888 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 888 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q1/2021 and belongs to the 8 generation of the Qualcomm Snapdragon series.
The HiSilicon Kirin 970 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2017 and belongs to the 6 generation of the HiSilicon Kirin series.
Mobile Segment Mobile
Qualcomm Snapdragon 888 Name HiSilicon Kirin 970
Qualcomm Snapdragon Family HiSilicon Kirin
8 Generation 6
Qualcomm Snapdragon 888 Group HiSilicon Kirin 970
 
 

CPU Cores and Base Frequency

The Qualcomm Snapdragon 888 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.84 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 970 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
4x Kryo 680 Silver Cores C None
1.8 GHz C-Core Frequency None
2.42 GHz B-Core Frequency 1.84 GHz
2.84 GHz A-Core Frequency 2.4 GHz
3x Kryo 680 Gold Cores B 4x Cortex-A53
1x Kryo 680 Prime Cores A 4x Cortex-A73
No Overclocking No
hybrid (Prime / big.LITTLE) Core architecture hybrid (big.LITTLE)
8 Threads 8
No Hyperthreading No
8 CPU Cores 8
 
 

Internal Graphics

The Qualcomm Snapdragon 888 has integrated graphics, called iGPU for short.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The HiSilicon Kirin 970 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 970 uses the ARM Mali-G72 MP12, which has 192 texture shaders
and 12 execution units.
0.84 GHz GPU frequency 0.75 GHz
Q1/2021 Release date Q3/2017
12.1 Direct X 12
Qualcomm Adreno 660 GPU name ARM Mali-G72 MP12
5 nm Technology 16 nm
-- Max. displays --
-- Shaders 192
0 bytes Max. GPU Memory 2.0 GB
-- Execution units 12
6 Generation Bifrost 2
-- GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode AVC Decode / Encode
Decode VC-1 Decode / Encode
Decode / Encode VP9 Decode / Encode
Decode / Encode h265 / HEVC (10 bit) Decode / Encode
Decode / Encode h264 Decode / Encode
Decode / Encode VP8 Decode / Encode
Decode / Encode h265 / HEVC (8 bit) Decode / Encode
Decode / Encode JPEG Decode / Encode
No AV1 No
 
 

Memory & PCIe

4 Memory channels 4
0 bytes Max. Memory 8.0 GB
pci PCIe pci
No AES-NI No
No ECC No
-- Bandwidth --
LPDDR4X-4266, LPDDR5-3200 Memory type LPDDR4X-2133
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 9 W watts.
-- Tjunction max --
None TDP (PL1 / PBP) 9 W
 
 

Technical details

The Qualcomm Snapdragon 888 is manufactured using a 5 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 8.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 970 is manufactured using a 10 nm process.
In total, this processor boasts a generous 2.0 MB cache.
Q1/2021 Release date Q3/2017
SM8350 Part Number --
1.0 MB L2-Cache 0 bytes
None Virtualization None
ISA extensions
Chiplet Chip design Chiplet
Kryo 680 Architecture Cortex-A73 / Cortex-A53
5 nm Technology 10 nm
Socket
Android Operating systems Android
-- Release price --
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
8.0 MB L3-Cache 2.0 MB
 
 

Qualcomm Snapdragon 888 and HiSilicon Kirin 970 in leaderboards