HiSilicon Kirin 970 Benchmark, Test and specs

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CPU lineage

The HiSilicon Kirin 970 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q3/2017 and belongs to the 6 generation of the HiSilicon Kirin series.
Name: HiSilicon Kirin 970
Family: HiSilicon Kirin
Group: HiSilicon Kirin 970
Segment: Mobile
Generation: 6

CPU Cores and Base Frequency

The HiSilicon Kirin 970 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.4 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
CPU Cores: 8
Threads: 8
Cores A: 4x Cortex-A73
Cores B: 4x Cortex-A53
Core architecture: hybrid (big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 2.4 GHz
B-Core Frequency: 1.84 GHz

Internal Graphics

The HiSilicon Kirin 970 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 970 uses the ARM Mali-G72 MP12, which has 192 texture shaders and 12 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: ARM Mali-G72 MP12
GPU frequency: 0.75 GHz
GPU (Turbo): --
Execution units: 12
Shaders: 192
Max. GPU Memory: 2.0 GB
Max. displays: --
Generation: Bifrost 2
Direct X: 12
Technology: 16 nm
Release date: Q3/2017

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode / Encode
h264: Decode / Encode
VP8: Decode / Encode
VP9: Decode / Encode
AV1: No
AVC: Decode / Encode
VC-1: Decode / Encode
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR4X-2133
Max. Memory: 8.0 GB
Memory channels: 4
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

The processor has a thermal design power (TDP) of 9 W watts. TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): 9 W
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The HiSilicon Kirin 970 is manufactured using a 10 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. In total, this processor boasts a generous 2.0 MB cache. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 10 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 2.0 MB
Architecture: Cortex-A73 / Cortex-A53
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv8-A64 (64 bit)
ISA extensions:
Release date: Q3/2017
Release price: --
Part Number: --
Documents: Technical data sheet
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Benchmarks

Geekbench 5, 64bit (Multi-Core)

Intel Celeron G3930
2C 2T @ 2.9 GHz
1465
1465
AMD A8-6600K
4C 4T @ 3.9 GHz
1461
1461
HiSilicon Kirin 970
8C 8T @ 2.4 GHz
1455
1455
Intel Core i5-5350U
2C 4T @ 1.8 GHz
1447
1447
Intel Core i3-4340TE
2C 4T @ 2.6 GHz
1445
1445

Geekbench 5, 64bit (Single-Core)

AMD A4-3400
2C 2T @ 2.7 GHz
349
349
Intel Atom C3758
8C 8T @ 2.2 GHz
349
349
HiSilicon Kirin 970
8C 8T @ 2.4 GHz
349
349
Intel Atom C3758
8C 8T @ 2.2 GHz
349
349
AMD A4-3400
2C 2T @ 2.7 GHz
349
349

iGPU - FP32 Performance (Single-precision GFLOPS)

Intel Celeron G6900TE
2C 2T @ 2.4 GHz
332
332
Intel Celeron G6900
2C 2T @ 3.4 GHz
332
332
HiSilicon Kirin 970
8C 8T @ 2.4 GHz
330
330
Intel Pentium Gold 4410Y
2C 4T @ 1.5 GHz
326
326
Intel Pentium Gold 4415Y
2C 4T @ 1.7 GHz
326
326