HiSilicon Kirin 970 vs Samsung Exynos 5422

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 970 or HiSilicon Kirin 970 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 970 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2017 and belongs to the 6 generation of the HiSilicon Kirin series.
The Samsung Exynos 5422 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q1/2014 and belongs to the 3 generation of the Samsung Exynos series.
6 Generation 3
HiSilicon Kirin Family Samsung Exynos
HiSilicon Kirin 970 Group Samsung Exynos 5260/5410/5420/5422/5800
HiSilicon Kirin 970 Name Samsung Exynos 5422
Mobile Segment Mobile
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 970 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Samsung Exynos 5422 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.1 GHz.
8 CPU Cores 8
1.84 GHz B-Core Frequency 1.4 GHz
8 Threads 8
hybrid (big.LITTLE) Core architecture hybrid (big.LITTLE)
No Overclocking No
2.4 GHz A-Core Frequency 2.1 GHz
No Hyperthreading No
4x Cortex-A53 Cores B 4x Cortex-A7
4x Cortex-A73 Cores A 4x Cortex-A15
 
 

Internal Graphics

The HiSilicon Kirin 970 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 970 uses the ARM Mali-G72 MP12, which has 192 texture shaders
and 12 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Samsung Exynos 5422 has integrated graphics, called iGPU for short.
Specifically, the Samsung Exynos 5422 uses the ARM Mali-T628 MP6, which has 96 texture shaders
and 6 execution units.
Bifrost 2 Generation Midgard 2
Q3/2017 Release date Q4/2012
-- Max. displays --
12 Execution units 6
192 Shaders 96
-- GPU (Turbo) --
0.75 GHz GPU frequency 0.53 GHz
16 nm Technology 32 nm
ARM Mali-G72 MP12 GPU name ARM Mali-T628 MP6
2.0 GB Max. GPU Memory 0 bytes
12 Direct X 11
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode JPEG No
Decode / Encode h264 Decode / Encode
No AV1 No
Decode / Encode VP9 No
Decode / Encode h265 / HEVC (10 bit) No
Decode / Encode AVC No
Decode / Encode h265 / HEVC (8 bit) No
Decode / Encode VP8 Decode / Encode
Decode / Encode VC-1 No
 
 

Memory & PCIe

4 Memory channels --
8.0 GB Max. Memory 0 bytes
LPDDR4X-2133 Memory type LPDDR3e-933
No AES-NI No
-- Bandwidth --
No ECC No
pci PCIe pci
 
 

Thermal Management

The processor has a thermal design power (TDP) of 9 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
9 W TDP (PL1 / PBP) None
-- Tjunction max --
 
 

Technical details

The HiSilicon Kirin 970 is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Samsung Exynos 5422 is manufactured using a 28 nm process.
Q3/2017 Release date Q1/2014
Cortex-A73 / Cortex-A53 Architecture Cortex-A15 / Cortex-A7
Technical data sheet Documents Technical data sheet
None Virtualization None
Chiplet Chip design --
2.0 MB L3-Cache 0 bytes
ISA extensions
10 nm Technology 28 nm
Socket
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv7-A32 (32 bit)
-- Part Number --
-- Release price --
Android Operating systems Android
0 bytes L2-Cache 2.5 MB