Intel Xeon D-2187NT vs HiSilicon Kirin 970

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Xeon D-2187NT or Intel Xeon D-2187NT – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon D-2187NT features 16 processor cores and has the capability to manage 32 threads concurrently.
It was released in Q1/2018 and belongs to the 2 generation of the Intel Xeon D series.
To use the Intel Xeon D-2187NT, you'll need a motherboard with a BGA 2518 socket.
The HiSilicon Kirin 970 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2017 and belongs to the 6 generation of the HiSilicon Kirin series.
2 Generation 6
Intel Xeon D Family HiSilicon Kirin
Intel Xeon D-2100 Group HiSilicon Kirin 970
Intel Xeon D-2187NT Name HiSilicon Kirin 970
Desktop / Server Segment Mobile
 
 

CPU Cores and Base Frequency

The Intel Xeon D-2187NT has 16 CPU cores and can calculate 32 threads in parallel.
The clock frequency of the Intel Xeon D-2187NT is 2.0 GHz
and turbo frequency for one core is 3.0 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 970 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
16 CPU Cores 8
None None 1.84 GHz
32 Threads 8
3.0 GHz Turbo Frequency (1 core) None
2.0 GHz Frequency None
16x Cores None
normal Core architecture hybrid (big.LITTLE)
No Overclocking No
None None 2.4 GHz
Yes Hyperthreading No
None None 4x Cortex-A53
None None 4x Cortex-A73
 
 

Internal Graphics

The Intel Xeon D-2187NT does not have integrated graphics.
The HiSilicon Kirin 970 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 970 uses the ARM Mali-G72 MP12, which has 192 texture shaders
and 12 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Generation Bifrost 2
-- Release date Q3/2017
-- Max. displays --
-- Execution units 12
-- Shaders 192
-- GPU (Turbo) --
-- GPU frequency 0.75 GHz
-- Technology 16 nm
GPU name ARM Mali-G72 MP12
0 bytes Max. GPU Memory 2.0 GB
-- Direct X 12
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- JPEG Decode / Encode
-- h264 Decode / Encode
-- AV1 No
-- VP9 Decode / Encode
-- h265 / HEVC (10 bit) Decode / Encode
-- AVC Decode / Encode
-- h265 / HEVC (8 bit) Decode / Encode
-- VP8 Decode / Encode
-- VC-1 Decode / Encode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 512.0 GB distributed across 4 memory channels. It offers a peak memory bandwidth of 85.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
4 Memory channels 4
512.0 GB Max. Memory 8.0 GB
DDR4-2666 Memory type LPDDR4X-2133
Yes AES-NI No
85.4 GB/s Bandwidth --
Yes ECC No
pci PCIe pci
 
 

Thermal Management

The processor has a thermal design power (TDP) of 110 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 9 W watts.
110 W TDP (PL1 / PBP) 9 W
-- Tjunction max --
 
 

Technical details

The Intel Xeon D-2187NT is manufactured using a 14 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 970 is manufactured using a 10 nm process.
In total, this processor boasts a generous 2.0 MB cache.
Q1/2018 Release date Q3/2017
Skylake Architecture Cortex-A73 / Cortex-A53
Technical data sheet Documents Technical data sheet
VT-x, VT-x EPT, VT-d Virtualization None
Monolithic Chip design Chiplet
0 bytes L3-Cache 2.0 MB
SSE4.1, SSE4.2, AVX2, AVX-512 ISA extensions
14 nm Technology 10 nm
BGA 2518 Socket
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
-- Part Number --
2128 $ Release price --
Windows 10, Linux Operating systems Android
22.0 MB L2-Cache 0 bytes