CPU comparison with benchmarks
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CPU lineage |
Intel Xeon D-2187NT or Intel Xeon D-2187NT – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes. The Intel Xeon D-2187NT features 16 processor cores and has the capability to manage 32 threads concurrently. It was released in Q1/2018 and belongs to the 2 generation of the Intel Xeon D series. To use the Intel Xeon D-2187NT, you'll need a motherboard with a BGA 2518 socket. The HiSilicon Kirin 970 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q3/2017 and belongs to the 6 generation of the HiSilicon Kirin series.
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Intel Xeon D |
Family |
HiSilicon Kirin |
Desktop / Server |
Segment |
Mobile |
Intel Xeon D-2187NT |
Name |
HiSilicon Kirin 970 |
Intel Xeon D-2100 |
Group |
HiSilicon Kirin 970 |
2 |
Generation |
6 |
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CPU Cores and Base Frequency |
The Intel Xeon D-2187NT has 16 CPU cores and can calculate 32 threads in parallel. The clock frequency of the Intel Xeon D-2187NT is 2.0 GHz and turbo frequency for one core is 3.0 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. The HiSilicon Kirin 970 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.4 GHz. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
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16x |
Cores |
None |
None |
None |
2.4 GHz |
None |
None |
1.84 GHz |
2.0 GHz |
Frequency |
None |
16 |
CPU Cores |
8 |
normal |
Core architecture |
hybrid (big.LITTLE) |
None |
None |
4x Cortex-A53 |
Yes |
Hyperthreading |
No |
None |
None |
4x Cortex-A73 |
No |
Overclocking |
No |
32 |
Threads |
8 |
3.0 GHz |
Turbo Frequency (1 core) |
None |
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Internal Graphics |
The Intel Xeon D-2187NT does not have integrated graphics. The HiSilicon Kirin 970 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 970 uses the ARM Mali-G72 MP12, which has 192 texture shaders and 12 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
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-- |
GPU (Turbo) |
-- |
-- |
Release date |
Q3/2017 |
-- |
Execution units |
12 |
-- |
Direct X |
12 |
-- |
Max. displays |
-- |
-- |
Shaders |
192 |
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GPU name |
ARM Mali-G72 MP12 |
-- |
GPU frequency |
0.75 GHz |
0 bytes |
Max. GPU Memory |
2.0 GB |
-- |
Generation |
Bifrost 2 |
-- |
Technology |
16 nm |
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Artificial Intelligence and Machine Learning |
-- |
AI specifications |
-- |
-- |
AI hardware |
-- |
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Hardware codec support |
A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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VP8 |
Decode / Encode |
-- |
VP9 |
Decode / Encode |
-- |
AVC |
Decode / Encode |
-- |
h264 |
Decode / Encode |
-- |
JPEG |
Decode / Encode |
-- |
VC-1 |
Decode / Encode |
-- |
AV1 |
No |
-- |
h265 / HEVC (8 bit) |
Decode / Encode |
-- |
h265 / HEVC (10 bit) |
Decode / Encode |
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Memory & PCIe |
The processor supports a maximum memory capacity of 512.0 GB distributed across 4 memory channels. It offers a peak memory bandwidth of 85.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
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Yes |
AES-NI |
No |
512.0 GB |
Max. Memory |
8.0 GB |
85.4 GB/s |
Bandwidth |
-- |
DDR4-2666 |
Memory type |
LPDDR4X-2133 |
pci |
PCIe |
pci |
4 |
Memory channels |
4 |
Yes |
ECC |
No |
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Thermal Management |
The processor has a thermal design power (TDP) of 110 W watts. TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself. The processor has a thermal design power (TDP) of 9 W watts.
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110 W |
TDP (PL1 / PBP) |
9 W |
-- |
Tjunction max |
-- |
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Technical details |
The Intel Xeon D-2187NT is manufactured using a 14 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The HiSilicon Kirin 970 is manufactured using a 10 nm process. In total, this processor boasts a generous 2.0 MB cache.
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Technical data sheet |
Documents |
Technical data sheet |
Q1/2018 |
Release date |
Q3/2017 |
BGA 2518 |
Socket |
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22.0 MB |
L2-Cache |
0 bytes |
0 bytes |
L3-Cache |
2.0 MB |
Windows 10, Linux |
Operating systems |
Android |
x86-64 (64 bit) |
Instruction set (ISA) |
ARMv8-A64 (64 bit) |
-- |
Part Number |
-- |
Skylake |
Architecture |
Cortex-A73 / Cortex-A53 |
VT-x, VT-x EPT, VT-d |
Virtualization |
None |
2128 $ |
Release price |
-- |
SSE4.1, SSE4.2, AVX2, AVX-512 |
ISA extensions |
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Monolithic |
Chip design |
Chiplet |
14 nm |
Technology |
10 nm |
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