CPU comparison with benchmarks
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-VS- |
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CPU lineage |
Raspberry Pi 3 B+ (Broadcom BCM2837B0) or Raspberry Pi 3 B+ (Broadcom BCM2837B0) – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes. The HiSilicon Kirin 9000E features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q4/2020 and belongs to the 9 generation of the HiSilicon Kirin series.
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Group |
HiSilicon Kirin 9000 |
| -- |
Generation |
9 |
| -- |
Segment |
Mobile |
| Raspberry Pi 3 B+ (Broadcom BCM2837B0) |
Name |
HiSilicon Kirin 9000E |
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Family |
HiSilicon Kirin |
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CPU Cores and Base Frequency |
The HiSilicon Kirin 9000E has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 3.13 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
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| -- |
Threads |
8 |
| -- |
Core architecture |
hybrid (Prime / big.LITTLE) |
| No |
Hyperthreading |
No |
| None |
None |
3.13 GHz |
| No |
Overclocking |
No |
| None |
None |
2.05 GHz |
| None |
None |
4x Cortex-A55 |
| None |
None |
2.54 GHz |
| -- |
CPU Cores |
8 |
| None |
None |
1x Cortex-A77 |
| None |
None |
3x Cortex-A77 |
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| |
Internal Graphics |
The Raspberry Pi 3 B+ (Broadcom BCM2837B0) does not have integrated graphics. The HiSilicon Kirin 9000E has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
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Shaders |
-- |
| -- |
Release date |
-- |
| -- |
Technology |
-- |
| -- |
Direct X |
-- |
| 0 bytes |
Max. GPU Memory |
0 bytes |
| -- |
Max. displays |
-- |
| -- |
Execution units |
-- |
| -- |
GPU frequency |
0.76 GHz |
| -- |
Generation |
-- |
| -- |
GPU (Turbo) |
-- |
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GPU name |
ARM Mali-G78 MP22 |
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Artificial Intelligence and Machine Learning |
| -- |
AI specifications |
-- |
| -- |
AI hardware |
-- |
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Hardware codec support |
A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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| -- |
VP8 |
-- |
| -- |
VC-1 |
-- |
| -- |
JPEG |
-- |
| -- |
AV1 |
-- |
| -- |
h265 / HEVC (8 bit) |
-- |
| -- |
AVC |
-- |
| -- |
h264 |
-- |
| -- |
VP9 |
-- |
| -- |
h265 / HEVC (10 bit) |
-- |
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| |
Memory & PCIe |
| pci |
PCIe |
pci |
| No |
AES-NI |
No |
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Memory type |
LPDDR4X-2133, LPDDR5-2750 |
| No |
ECC |
No |
| 0 bytes |
Max. Memory |
0 bytes |
| -- |
Memory channels |
4 |
| -- |
Bandwidth |
-- |
| |
| |
Thermal Management |
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
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| -- |
Tjunction max |
-- |
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Technical details |
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The HiSilicon Kirin 9000E is manufactured using a 5 nm process.
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| -- |
Release date |
Q4/2020 |
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Virtualization |
None |
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ISA extensions |
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| -- |
Technology |
5 nm |
| -- |
Chip design |
Chiplet |
| -- |
Release price |
-- |
| -- |
Architecture |
Cortex-A77 / Cortex-A55 |
| 0 bytes |
L3-Cache |
0 bytes |
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Operating systems |
Android |
| Technical data sheet |
Documents |
Technical data sheet |
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Instruction set (ISA) |
ARMv8-A64 (64 bit) |
| -- |
Part Number |
-- |
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Socket |
|
| 0 bytes |
L2-Cache |
0 bytes |
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