Raspberry Pi 3 B+ (Broadcom BCM2837B0) vs HiSilicon Kirin 9000E

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CPU comparison with benchmarks

-VS-

CPU lineage

Raspberry Pi 3 B+ (Broadcom BCM2837B0) or Raspberry Pi 3 B+ (Broadcom BCM2837B0) – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 9000E features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q4/2020 and belongs to the 9 generation of the HiSilicon Kirin series.
Group HiSilicon Kirin 9000
-- Generation 9
-- Segment Mobile
Raspberry Pi 3 B+ (Broadcom BCM2837B0) Name HiSilicon Kirin 9000E
Family HiSilicon Kirin
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 9000E has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 3.13 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
-- Threads 8
-- Core architecture hybrid (Prime / big.LITTLE)
No Hyperthreading No
None None 3.13 GHz
No Overclocking No
None None 2.05 GHz
None None 4x Cortex-A55
None None 2.54 GHz
-- CPU Cores 8
None None 1x Cortex-A77
None None 3x Cortex-A77
 
 

Internal Graphics

The Raspberry Pi 3 B+ (Broadcom BCM2837B0) does not have integrated graphics.
The HiSilicon Kirin 9000E has integrated graphics, called iGPU for short.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Shaders --
-- Release date --
-- Technology --
-- Direct X --
0 bytes Max. GPU Memory 0 bytes
-- Max. displays --
-- Execution units --
-- GPU frequency 0.76 GHz
-- Generation --
-- GPU (Turbo) --
GPU name ARM Mali-G78 MP22
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP8 --
-- VC-1 --
-- JPEG --
-- AV1 --
-- h265 / HEVC (8 bit) --
-- AVC --
-- h264 --
-- VP9 --
-- h265 / HEVC (10 bit) --
 
 

Memory & PCIe

pci PCIe pci
No AES-NI No
Memory type LPDDR4X-2133, LPDDR5-2750
No ECC No
0 bytes Max. Memory 0 bytes
-- Memory channels 4
-- Bandwidth --
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 9000E is manufactured using a 5 nm process.
-- Release date Q4/2020
Virtualization None
ISA extensions
-- Technology 5 nm
-- Chip design Chiplet
-- Release price --
-- Architecture Cortex-A77 / Cortex-A55
0 bytes L3-Cache 0 bytes
Operating systems Android
Technical data sheet Documents Technical data sheet
Instruction set (ISA) ARMv8-A64 (64 bit)
-- Part Number --
Socket
0 bytes L2-Cache 0 bytes