HiSilicon Kirin 9000E vs Intel Celeron E3200

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 9000E or HiSilicon Kirin 9000E – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 9000E features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q4/2020 and belongs to the 9 generation of the HiSilicon Kirin series.
The Intel Celeron E3200 features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q3/2009 and belongs to the 1 generation of the Intel Celeron series.
To use the Intel Celeron E3200, you'll need a motherboard with a LGA 775 socket.
HiSilicon Kirin 9000 Group Intel Celeron E3000
9 Generation 1
Mobile Segment Desktop / Server
HiSilicon Kirin 9000E Name Intel Celeron E3200
HiSilicon Kirin Family Intel Celeron
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 9000E has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 3.13 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The Intel Celeron E3200 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Celeron E3200 is 2.4 GHz
4x Cortex-A55 Cores C None
8 Threads 2
2.54 GHz B-Core Frequency None
None None 2x Core
8 CPU Cores 2
hybrid (Prime / big.LITTLE) Core architecture normal
1x Cortex-A77 Cores A None
No Hyperthreading No
3.13 GHz A-Core Frequency None
No Overclocking Yes
3x Cortex-A77 Cores B None
2.05 GHz C-Core Frequency None
None None 2.4 GHz
 
 

Internal Graphics

The HiSilicon Kirin 9000E has integrated graphics, called iGPU for short.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Celeron E3200 does not have integrated graphics.
-- Shaders --
-- Release date --
-- Technology --
-- Direct X --
0 bytes Max. GPU Memory 0 bytes
-- Max. displays --
-- Execution units --
0.76 GHz GPU frequency --
-- Generation --
-- GPU (Turbo) --
ARM Mali-G78 MP22 GPU name
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP8 --
-- VC-1 --
-- JPEG --
-- AV1 --
-- h265 / HEVC (8 bit) --
-- AVC --
-- h264 --
-- VP9 --
-- h265 / HEVC (10 bit) --
 
 

Memory & PCIe

pci PCIe pci
No AES-NI No
LPDDR4X-2133, LPDDR5-2750 Memory type DDR3-1066, DDR2-800
No ECC No
0 bytes Max. Memory 16.0 GB
4 Memory channels 2
-- Bandwidth --
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 65 W watts.
None TDP (PL1 / PBP) 65 W
-- Tjunction max --
 
 

Technical details

The HiSilicon Kirin 9000E is manufactured using a 5 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Celeron E3200 is manufactured using a 45 nm process.
Q4/2020 Release date Q3/2009
None Virtualization VT-x
ISA extensions SSE3, MMX, SSE, SSE2
5 nm Technology 45 nm
Chiplet Chip design Monolithic
-- Release price 47 $
Cortex-A77 / Cortex-A55 Architecture Wolfdale (Penryn)
0 bytes L3-Cache 0 bytes
Android Operating systems Windows 10, Linux
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
-- Part Number --
Socket LGA 775
0 bytes L2-Cache 1.0 MB