HiSilicon Kirin 9000 Benchmark, Test and specs

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CPU lineage

The HiSilicon Kirin 9000 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q4/2020 and belongs to the 9 generation of the HiSilicon Kirin series.
Name: HiSilicon Kirin 9000
Family: HiSilicon Kirin
Group: HiSilicon Kirin 9000
Segment: Mobile
Generation: 9

CPU Cores and Base Frequency

The HiSilicon Kirin 9000 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 3.13 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
CPU Cores: 8
Threads: 8
Cores A: 1x Cortex-A77
Cores B: 3x Cortex-A77
Cores C: 4x Cortex-A55
Core architecture: hybrid (Prime / big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 3.13 GHz
B-Core Frequency: 2.54 GHz
C-Core Frequency: 2.05 GHz

Internal Graphics

The HiSilicon Kirin 9000 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 9000 uses the ARM Mali-G78 MP24, which has 384 texture shaders and 24 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: ARM Mali-G78 MP24
GPU frequency: 0.76 GHz
GPU (Turbo): --
Execution units: 24
Shaders: 384
Max. GPU Memory: 0 bytes
Max. displays: --
Generation: Vallhall 2
Direct X: 12
Technology: 5 nm
Release date: Q4/2020

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode / Encode
h264: Decode / Encode
VP8: Decode / Encode
VP9: Decode / Encode
AV1: Decode
AVC: Decode / Encode
VC-1: Decode / Encode
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR4X-2133, LPDDR5-2750
Max. Memory: 0 bytes
Memory channels: 4
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): None
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The HiSilicon Kirin 9000 is manufactured using a 5 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 5 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 0 bytes
Architecture: Cortex-A77 / Cortex-A55
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv8-A64 (64 bit)
ISA extensions:
Release date: Q4/2020
Release price: --
Part Number: --
Documents: Technical data sheet
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Benchmarks

AnTuTu 8 Benchmark

Qualcomm Snapdragon 888+
8C 8T @ 3.0 GHz
708964
708964
Samsung Exynos 1080
8C 8T @ 2.8 GHz
688300
688300
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz
683679
683679
Qualcomm Snapdragon 870
8C 8T @ 3.2 GHz
651364
651364
MediaTek Dimensity 1300
8C 8T @ 3.0 GHz
647817
647817

Geekbench 5, 64bit (Multi-Core)

Intel Xeon D-1528
6C 12T @ 1.9 GHz
3768
3768
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz
3767
3767
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz
3767
3767
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz
3767
3767
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz
3765
3765

iGPU - FP32 Performance (Single-precision GFLOPS)

Intel Core i5-8305G
4C 8T @ 2.8 GHz
2588
2588
Qualcomm Snapdragon 8+ Gen 1
8C 8T @ 3.2 GHz
2454
2454
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz
2332
2332
Apple M1 (7-GPU)
8C 8T @ 3.2 GHz
2290
2290
Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.0 GHz
2236
2236

Geekbench 5, 64bit (Single-Core)

HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz
1063
1063
Intel Xeon Platinum 8180M
28C 56T @ 2.5 GHz
1063
1063
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz
1063
1063
Intel Xeon Platinum 8180M
28C 56T @ 2.5 GHz
1063
1063
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz
1063
1063