HiSilicon Kirin 935 Benchmark, Test and specs

Last updated:

CPU lineage

Name: HiSilicon Kirin 935
Family:
Group:
Segment: --
Generation: --

CPU Cores and Base Frequency

CPU Cores: --
Threads: --
Core architecture: --
Hyperthreading: No
Overclocking: No

Memory & PCIe

Memory type:
Max. Memory: 0 bytes
Memory channels: --
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): None
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: --
Chip design: --
Socket:
L2-Cache: 0 bytes
L3-Cache: 0 bytes
Architecture: --
Operating systems:
Virtualization:
Instruction set (ISA):
ISA extensions:
Release date: --
Release price: --
Part Number: --
Documents: Technical data sheet
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Benchmarks

iGPU - FP32 Performance (Single-precision GFLOPS)

AMD E1 Micro-6200T
2C 2T @ 1.0 GHz
90
90
AMD E1-6010
2C 2T @ 1.35 GHz
90
90
HiSilicon Kirin 935
NoneC NoneT @ --
87
87
Intel Celeron 1047UE
2C 2T @ 1.4 GHz
86
86
AMD E1-1200
2C 2T @ 1.4 GHz
85
85

All benchmarks for HiSilicon Kirin 935