HiSilicon Kirin 950 Benchmark, Test and specs

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CPU lineage

The HiSilicon Kirin 950 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q4/2015 and belongs to the 4 generation of the HiSilicon Kirin series.
Name: HiSilicon Kirin 950
Family: HiSilicon Kirin
Group: HiSilicon Kirin 950
Segment: Mobile
Generation: 4

CPU Cores and Base Frequency

The HiSilicon Kirin 950 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.3 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
CPU Cores: 8
Threads: 8
Cores A: 4x Cortex-A72
Cores B: 4x Cortex-A53
Core architecture: hybrid (big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 2.3 GHz
B-Core Frequency: 1.8 GHz

Internal Graphics

The HiSilicon Kirin 950 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 950 uses the ARM Mali-T880 MP4, which has 64 texture shaders and 4 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: ARM Mali-T880 MP4
GPU frequency: 0.9 GHz
GPU (Turbo): 0.9 GHz
Execution units: 4
Shaders: 64
Max. GPU Memory: 0 bytes
Max. displays: --
Generation: Midgard 4
Direct X: 11
Technology: 16 nm
Release date: Q2/2016

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode
h264: Decode / Encode
VP8: Decode / Encode
VP9: No
AV1: No
AVC: No
VC-1: No
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR4
Max. Memory: 0 bytes
Memory channels: 2
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): None
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The HiSilicon Kirin 950 is manufactured using a 16 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 16 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 0 bytes
Architecture: Cortex-A72 / Cortex-A53
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv8-A64 (64 bit)
ISA extensions:
Release date: Q4/2015
Release price: --
Part Number: --
Documents: Technical data sheet
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Benchmarks

Geekbench 5, 64bit (Multi-Core)

Intel Pentium G3440T
2C 2T @ 2.8 GHz
1194
1194
Intel Pentium G3250T
2C 2T @ 2.8 GHz
1194
1194
HiSilicon Kirin 950
8C 8T @ 2.3 GHz
1183
1183
Qualcomm Snapdragon 626
NoneC NoneT @ --
1181
1181
Intel Celeron 6305E
2C 2T @ 1.8 GHz
1180
1180

Geekbench 5, 64bit (Single-Core)

Intel Pentium E2220
2C 2T @ 2.4 GHz
331
331
AMD Athlon II X4 615e
4C 4T @ 2.5 GHz
331
331
HiSilicon Kirin 950
8C 8T @ 2.3 GHz
331
331
Samsung Exynos 8890
NoneC NoneT @ --
331
331
AMD Athlon II X3 425
3C 3T @ 2.7 GHz
331
331

iGPU - FP32 Performance (Single-precision GFLOPS)

Intel Celeron N3350
2C 2T @ 1.1 GHz
125
125
HiSilicon Kirin 955
8C 8T @ 2.5 GHz
122
122
HiSilicon Kirin 950
8C 8T @ 2.3 GHz
122
122
HiSilicon Kirin 955
8C 8T @ 2.5 GHz
122
122
AMD E2-3000
2C 2T @ 1.65 GHz
115
115