Qualcomm Snapdragon 850 Benchmark, Test and specs

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CPU lineage

The Qualcomm Snapdragon 850 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q3/2018 and belongs to the 5 generation of the Qualcomm Snapdragon series.
Name: Qualcomm Snapdragon 850
Family: Qualcomm Snapdragon
Group: Qualcomm Snapdragon 845/850
Segment: Mobile
Generation: 5

CPU Cores and Base Frequency

The Qualcomm Snapdragon 850 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.95 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
CPU Cores: 8
Threads: 8
Cores A: 4x Kryo 385 Gold
Cores B: 4x Kryo 385 Silver
Core architecture: hybrid (big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 2.95 GHz
B-Core Frequency: 1.8 GHz

Internal Graphics

The Qualcomm Snapdragon 850 has integrated graphics, called iGPU for short. Specifically, the Qualcomm Snapdragon 850 uses the Qualcomm Adreno 630, which has 256 texture shaders The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: Qualcomm Adreno 630
GPU frequency: 0.7 GHz
GPU (Turbo): --
Execution units: --
Shaders: 256
Max. GPU Memory: 8.0 GB
Max. displays: --
Generation: 4
Direct X: 11
Technology: 10 nm
Release date: Q1/2018

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode
h265 / HEVC (10 bit): Decode
h264: Decode / Encode
VP8: Decode
VP9: Decode
AV1: No
AVC: Decode
VC-1: Decode
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR4X-1866
Max. Memory: 8.0 GB
Memory channels: 4
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): None
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The Qualcomm Snapdragon 850 is manufactured using a 10 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 10 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 0 bytes
Architecture: Kryo 385
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv8-A64 (64 bit)
ISA extensions:
Release date: Q3/2018
Release price: --
Part Number: SDM850
Documents: Technical data sheet
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Benchmarks

Geekbench 5, 64bit (Multi-Core)

Intel Pentium N6211
4C 4T @ 1.2 GHz
1955
1955
Intel Pentium N6415
4C 4T @ 1.2 GHz
1955
1955
Qualcomm Snapdragon 850
8C 8T @ 2.95 GHz
1953
1953
Intel Core i3-4350
2C 4T @ 3.6 GHz
1944
1944
Intel Core i5-7300U
2C 4T @ 2.6 GHz
1943
1943

iGPU - FP32 Performance (Single-precision GFLOPS)

HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz
737
737
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz
737
737
Qualcomm Snapdragon 850
8C 8T @ 2.95 GHz
737
737
Qualcomm Snapdragon 845
8C 8T @ 2.8 GHz
737
737
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz
737
737

Geekbench 5, 64bit (Single-Core)

Intel Core i3-550
2C 4T @ 3.2 GHz
489
489
AMD A12-9720P
4C 4T @ 2.7 GHz
489
489
Qualcomm Snapdragon 850
8C 8T @ 2.95 GHz
489
489
AMD A8-6500
4C 4T @ 3.5 GHz
489
489
AMD A12-9720P
4C 4T @ 2.7 GHz
489
489