HiSilicon Kirin 655 vs Intel Xeon Platinum 8352Y

HiSilicon Kirin 655 or HiSilicon Kirin 655 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 655 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
The Intel Xeon Platinum 8352Y features 32 processor cores and has the capability to manage 64 threads concurrently.
It was released in Q2/2021 and belongs to the 3 generation of the Intel Xeon Platinum series.
To use the Intel Xeon Platinum 8352Y, you'll need a motherboard with a LGA 4189 socket.

The HiSilicon Kirin 655 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.12 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Intel Xeon Platinum 8352Y has 32 CPU cores and can calculate 64 threads in parallel.
The clock frequency of the Intel Xeon Platinum 8352Y is 2.2 GHz
and turbo frequency for one core is 3.4 GHz.

The HiSilicon Kirin 655 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 655 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Xeon Platinum 8352Y does not have integrated graphics.

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

The processor supports a maximum memory capacity of 6.0 TB distributed across 8 memory channels. It offers a peak memory bandwidth of 204.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 205 W watts.

The HiSilicon Kirin 655 is manufactured using a 16 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Xeon Platinum 8352Y is manufactured using a 10 nm process.
In total, this processor boasts a generous 48.0 MB cache.