CPU comparison with benchmarks |
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CPU lineage |
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HiSilicon Kirin 710 or HiSilicon Kirin 710 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 710 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q3/2018 and belongs to the 5 generation of the HiSilicon Kirin series. The Intel Core2 Duo T5870 features 2 processor cores and has the capability to manage 2 threads concurrently. It belongs to the 1 generation of the Intel Celeron series. |
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| HiSilicon Kirin 710 | Group | Intel Core 2 Duo T5000 |
| 5 | Generation | 1 |
| HiSilicon Kirin 710 | Name | Intel Core2 Duo T5870 |
| Mobile | Segment | Mobile |
| HiSilicon Kirin | Family | Intel Celeron |
CPU Cores and Base Frequency |
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The HiSilicon Kirin 710 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.2 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices. The Intel Core2 Duo T5870 has 2 CPU cores and can calculate 2 threads in parallel. The clock frequency of the Intel Core2 Duo T5870 is 2.0 GHz |
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| 1.7 GHz | B-Core Frequency | None |
| None | None | 2x |
| hybrid (big.LITTLE) | Core architecture | normal |
| 4x Cortex-A73 | Cores A | None |
| 8 | CPU Cores | 2 |
| No | Overclocking | No |
| None | None | 2.0 GHz |
| No | Hyperthreading | No |
| 2.2 GHz | A-Core Frequency | None |
| 4x Cortex-A53 | Cores B | None |
| 8 | Threads | 2 |
Internal Graphics |
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The HiSilicon Kirin 710 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 710 uses the ARM Mali-G51 MP4, which has 128 texture shaders and 8 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. The Intel Core2 Duo T5870 does not have integrated graphics. |
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| 1.0 GHz | GPU (Turbo) | -- |
| 12 nm | Technology | -- |
| 11 | Direct X | -- |
| 4.0 GB | Max. GPU Memory | 0 bytes |
| 8 | Execution units | -- |
| Q2/2018 | Release date | -- |
| ARM Mali-G51 MP4 | GPU name | |
| 128 | Shaders | -- |
| 0.65 GHz | GPU frequency | -- |
| Bifrost 1 | Generation | -- |
| -- | Max. displays | -- |
Artificial Intelligence and Machine Learning |
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| -- | AI specifications | -- |
| -- | AI hardware | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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| Decode / Encode | h265 / HEVC (8 bit) | -- |
| Decode / Encode | VP9 | -- |
| Decode / Encode | VP8 | -- |
| Decode / Encode | VC-1 | -- |
| Decode / Encode | JPEG | -- |
| Decode / Encode | h264 | -- |
| No | h265 / HEVC (10 bit) | -- |
| Decode / Encode | AVC | -- |
| No | AV1 | -- |
Memory & PCIe |
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| LPDDR3, LPDDR4 | Memory type | |
| -- | Bandwidth | -- |
| No | AES-NI | No |
| No | ECC | No |
| pci | PCIe | pci |
| 6.0 GB | Max. Memory | 0 bytes |
| 2 | Memory channels | -- |
Thermal Management |
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The processor has a thermal design power (TDP) of 5 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself. The processor has a thermal design power (TDP) of 35 W watts. |
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| 5 W | TDP (PL1 / PBP) | 35 W |
| -- | Tjunction max | 100 °C |
Technical details |
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The HiSilicon Kirin 710 is manufactured using a 12 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. In total, this processor boasts a generous 1.0 MB cache. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The Intel Core2 Duo T5870 is manufactured using a 65 nm process. |
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| None | Virtualization | VT-x |
| 12 nm | Technology | 65 nm |
| ARMv8-A64 (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
| ISA extensions | SSE3, MMX, SSE, SSE2 | |
| -- | Part Number | -- |
| Chiplet | Chip design | Monolithic |
| Q3/2018 | Release date | -- |
| -- | Release price | -- |
| 0 bytes | L2-Cache | 2.0 MB |
| Technical data sheet | Documents | Technical data sheet |
| 1.0 MB | L3-Cache | 0 bytes |
| Socket | ||
| Android | Operating systems | |
| Cortex-A73 / Cortex-A53 | Architecture | Merom (Core) |
AnTuTu 9 Benchmark
AnTuTu 8 Benchmark
Geekbench 5, 64bit (Multi-Core)
Geekbench 6 (Multi-Core)
Geekbench 6 (Single-Core)
Geekbench 5, 64bit (Single-Core)
CPU-Z Benchmark 17 (Multi-Core)
iGPU - FP32 Performance (Single-precision GFLOPS)
