HiSilicon Kirin 810 vs Intel Core2 Solo U2200

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 810 or HiSilicon Kirin 810 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 810 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2019 and belongs to the 6 generation of the HiSilicon Kirin series.
The Intel Core2 Solo U2200 features 1 processor cores and has the capability to manage 1 threads concurrently.
It was released in Q3/2007 and belongs to the 1 generation of the Intel Core2 Solo series.
To use the Intel Core2 Solo U2200, you'll need a motherboard with a PGA 478 socket.
HiSilicon Kirin 810/820 Group Intel Core 2 Solo U2000
6 Generation 1
HiSilicon Kirin 810 Name Intel Core2 Solo U2200
Mobile Segment Mobile
HiSilicon Kirin Family Intel Core2 Solo
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 810 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.2 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Intel Core2 Solo U2200 has 1 CPU cores and can calculate 1 threads in parallel.
The clock frequency of the Intel Core2 Solo U2200 is 1.2 GHz
The processor has one core only.
1.9 GHz B-Core Frequency None
None None 1x Core
hybrid (big.LITTLE) Core architecture normal
2x Cortex-A76 Cores A None
8 CPU Cores 1
No Overclocking No
None None 1.2 GHz
No Hyperthreading No
2.2 GHz A-Core Frequency None
6x Cortex-A55 Cores B None
8 Threads 1
 
 

Internal Graphics

The HiSilicon Kirin 810 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 810 uses the ARM Mali-G52 MP6, which has 288 texture shaders
and 16 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Core2 Solo U2200 does not have integrated graphics.
-- GPU (Turbo) --
12 nm Technology --
12 Direct X --
4.0 GB Max. GPU Memory 0 bytes
16 Execution units --
Q1/2018 Release date --
ARM Mali-G52 MP6 GPU name
288 Shaders --
0.85 GHz GPU frequency --
Bifrost 2 Generation --
-- Max. displays --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode h265 / HEVC (8 bit) --
Decode / Encode VP9 --
Decode / Encode VP8 --
Decode / Encode VC-1 --
Decode / Encode JPEG --
Decode / Encode h264 --
Decode / Encode h265 / HEVC (10 bit) --
Decode / Encode AVC --
No AV1 --
 
 

Memory & PCIe

LPDDR4X-2133 Memory type DDR2-800
-- Bandwidth --
No AES-NI No
No ECC No
pci PCIe pci
6.0 GB Max. Memory 8.0 GB
4 Memory channels 2
 
 

Thermal Management

The processor has a thermal design power (TDP) of 5 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 5.5 W watts.
5 W TDP (PL1 / PBP) 5.5 W
-- Tjunction max 100 °C
 
 

Technical details

The HiSilicon Kirin 810 is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 1.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Core2 Solo U2200 is manufactured using a 65 nm process.
None Virtualization VT-x
7 nm Technology 65 nm
ARMv8-A64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
ISA extensions SSE3, MMX, SSE, SSE2
-- Part Number --
Chiplet Chip design Monolithic
Q2/2019 Release date Q3/2007
-- Release price --
0 bytes L2-Cache 1.0 MB
Technical data sheet Documents Technical data sheet
1.0 MB L3-Cache 0 bytes
Socket PGA 478
Android Operating systems
Cortex-A76 / Cortex-A55 Architecture Merom (Core)