HiSilicon Kirin 820E 5G vs MediaTek Dimensity 900

HiSilicon Kirin 820E 5G or HiSilicon Kirin 820E 5G – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 820E 5G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q1/2021 and belongs to the 6 generation of the HiSilicon Kirin series.
The MediaTek Dimensity 900 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2021 and belongs to the 2 generation of the Mediatek Dimensity series.

The HiSilicon Kirin 820E 5G has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.22 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The MediaTek Dimensity 900 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.

The HiSilicon Kirin 820E 5G has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 820E 5G uses the ARM Mali-G57 MP6, which has 96 texture shaders
and 6 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The MediaTek Dimensity 900 has integrated graphics, called iGPU for short.
Specifically, the MediaTek Dimensity 900 uses the ARM Mali-G68 MP4, which has 64 texture shaders
and 4 execution units.

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

The processor has a thermal design power (TDP) of 6 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 10 W watts.

The HiSilicon Kirin 820E 5G is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The MediaTek Dimensity 900 is manufactured using a 6 nm process.