HiSilicon Kirin 820E 5G Benchmark, Test and specs

Last updated:

CPU lineage

The HiSilicon Kirin 820E 5G features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q1/2021 and belongs to the 6 generation of the HiSilicon Kirin series.
Name: HiSilicon Kirin 820E 5G
Family: HiSilicon Kirin
Group: HiSilicon Kirin 810/820
Segment: Mobile
Generation: 6

CPU Cores and Base Frequency

The HiSilicon Kirin 820E 5G has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.22 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
CPU Cores: 8
Threads: 8
Cores A: 3x Cortex-A76
Cores B: 3x Cortex-A55
Core architecture: hybrid (big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 2.22 GHz
B-Core Frequency: 1.84 GHz

Internal Graphics

The HiSilicon Kirin 820E 5G has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 820E 5G uses the ARM Mali-G57 MP6, which has 96 texture shaders and 6 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: ARM Mali-G57 MP6
GPU frequency: 0.85 GHz
GPU (Turbo): --
Execution units: 6
Shaders: 96
Max. GPU Memory: 4.0 GB
Max. displays: --
Generation: Vallhall 1
Direct X: 12
Technology: 7 nm
Release date: Q2/2020

Artificial Intelligence and Machine Learning

AI hardware: HUAWEI HiAI 2.0
AI specifications: Da Vinci Architecture. Ascend D110 Lite

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode / Encode
h264: Decode / Encode
VP8: Decode / Encode
VP9: Decode / Encode
AV1: Decode
AVC: Decode / Encode
VC-1: Decode / Encode
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR4X-2133
Max. Memory: 0 bytes
Memory channels: 4
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

The processor has a thermal design power (TDP) of 6 W watts. TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): 6 W
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The HiSilicon Kirin 820E 5G is manufactured using a 7 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. In total, this processor boasts a generous 2.0 MB cache. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 7 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 2.0 MB
Architecture: Cortex-A76 / Cortex-A55
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv8-A64 (64 bit)
ISA extensions:
Release date: Q1/2021
Release price: --
Part Number: --
Documents: Technical data sheet
ADS

Benchmarks

AnTuTu 8 Benchmark

Qualcomm Snapdragon 845
8C 8T @ 2.8 GHz
361498
361498
Qualcomm Snapdragon 768G
NoneC NoneT @ --
354320
354320
HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz
351366
351366
MediaTek Dimensity 800U
8C 8T @ 2.4 GHz
334689
334689
Qualcomm Snapdragon 750G
NoneC NoneT @ --
333611
333611

iGPU - FP32 Performance (Single-precision GFLOPS)

Intel Celeron N5100
4C 4T @ 1.1 GHz
653
653
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz
653
653
HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz
653
653
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz
653
653
Intel Celeron N5100
4C 4T @ 1.1 GHz
653
653

All benchmarks for HiSilicon Kirin 820E 5G