HiSilicon Kirin 955 vs Samsung Exynos 7570

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 955 or HiSilicon Kirin 955 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 955 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
4 Generation --
HiSilicon Kirin Family
HiSilicon Kirin 950 Group
HiSilicon Kirin 955 Name Samsung Exynos 7570
Mobile Segment --
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 955 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.5 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
8 Threads --
hybrid (big.LITTLE) Core architecture --
No Hyperthreading No
No Overclocking No
2.5 GHz A-Core Frequency None
8 CPU Cores --
4x Cortex-A72 Cores A None
1.8 GHz B-Core Frequency None
4x Cortex-A53 Cores B None
 
 

Internal Graphics

The HiSilicon Kirin 955 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 955 uses the ARM Mali-T880 MP4, which has 64 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Samsung Exynos 7570 does not have integrated graphics.
0 bytes Max. GPU Memory 0 bytes
ARM Mali-T880 MP4 GPU name
0.9 GHz GPU (Turbo) --
-- Max. displays --
16 nm Technology --
0.9 GHz GPU frequency --
Q2/2016 Release date --
Midgard 4 Generation --
64 Shaders --
4 Execution units --
11 Direct X --
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
No AVC --
Decode h265 / HEVC (10 bit) --
Decode / Encode VP8 --
No VP9 --
Decode / Encode h265 / HEVC (8 bit) --
No VC-1 --
Decode / Encode h264 --
No AV1 --
Decode / Encode JPEG --
 
 

Memory & PCIe

pci PCIe pci
0 bytes Max. Memory 0 bytes
No AES-NI No
-- Bandwidth --
2 Memory channels --
No ECC No
LPDDR3, LPDDR4 Memory type
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

The HiSilicon Kirin 955 is manufactured using a 16 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Chiplet Chip design --
None Virtualization
0 bytes L3-Cache 0 bytes
16 nm Technology --
Q2/2016 Release date --
-- Release price --
Technical data sheet Documents Technical data sheet
Socket
ARMv8-A64 (64 bit) Instruction set (ISA)
ISA extensions
Cortex-A72 / Cortex-A53 Architecture --
-- Part Number --
Android Operating systems
0 bytes L2-Cache 0 bytes