HiSilicon Kirin 955 vs Samsung Exynos 7570

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 955 or HiSilicon Kirin 955 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 955 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
HiSilicon Kirin 955 Name Samsung Exynos 7570
Mobile Segment --
4 Generation --
HiSilicon Kirin 950 Group
HiSilicon Kirin Family
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 955 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.5 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
8 Threads --
No Hyperthreading No
No Overclocking No
4x Cortex-A53 Cores B None
hybrid (big.LITTLE) Core architecture --
2.5 GHz A-Core Frequency None
1.8 GHz B-Core Frequency None
4x Cortex-A72 Cores A None
8 CPU Cores --
 
 

Internal Graphics

The HiSilicon Kirin 955 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 955 uses the ARM Mali-T880 MP4, which has 64 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Samsung Exynos 7570 does not have integrated graphics.
16 nm Technology --
ARM Mali-T880 MP4 GPU name
0 bytes Max. GPU Memory 0 bytes
Midgard 4 Generation --
64 Shaders --
0.9 GHz GPU (Turbo) --
-- Max. displays --
Q2/2016 Release date --
4 Execution units --
11 Direct X --
0.9 GHz GPU frequency --
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode JPEG --
No VC-1 --
Decode / Encode h264 --
No AVC --
Decode / Encode VP8 --
Decode / Encode h265 / HEVC (8 bit) --
No AV1 --
No VP9 --
Decode h265 / HEVC (10 bit) --
 
 

Memory & PCIe

0 bytes Max. Memory 0 bytes
-- Bandwidth --
pci PCIe pci
No ECC No
No AES-NI No
2 Memory channels --
LPDDR3, LPDDR4 Memory type
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

The HiSilicon Kirin 955 is manufactured using a 16 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Cortex-A72 / Cortex-A53 Architecture --
-- Release price --
Chiplet Chip design --
0 bytes L3-Cache 0 bytes
-- Part Number --
Technical data sheet Documents Technical data sheet
None Virtualization
Android Operating systems
0 bytes L2-Cache 0 bytes
Q2/2016 Release date --
ARMv8-A64 (64 bit) Instruction set (ISA)
16 nm Technology --
ISA extensions
Socket