HiSilicon Kirin 955 vs Intel Atom x6200FE

HiSilicon Kirin 955 or HiSilicon Kirin 955 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 955 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
The Intel Atom x6200FE features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q1/2021 and belongs to the 6 generation of the Intel Atom series.
To use the Intel Atom x6200FE, you'll need a motherboard with a BGA 1493 socket.

The HiSilicon Kirin 955 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.5 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Intel Atom x6200FE has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Atom x6200FE is 1.0 GHz

The HiSilicon Kirin 955 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 955 uses the ARM Mali-T880 MP4, which has 64 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Atom x6200FE does not have integrated graphics.

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

The processor supports a maximum memory capacity of 32.0 GB distributed across 4 memory channels. It offers a peak memory bandwidth of 38.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 4.5 W watts.

The HiSilicon Kirin 955 is manufactured using a 16 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Atom x6200FE is manufactured using a 10 nm process.