Intel Celeron SU2300 vs AMD EPYC 7343

Last updated:

CPU comparison with benchmarks

-VS-

CPU lineage

Intel Celeron SU2300 or Intel Celeron SU2300 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Celeron SU2300 features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q3/2009 and belongs to the 1 generation of the Intel Celeron series.
To use the Intel Celeron SU2300, you'll need a motherboard with a BGA 956 socket.
The AMD EPYC 7343 features 16 processor cores and has the capability to manage 32 threads concurrently.
It was released in Q1/2021 and belongs to the 3 generation of the AMD EPYC series.
To use the AMD EPYC 7343, you'll need a motherboard with a SP3 socket.
Intel Celeron Family AMD EPYC
Mobile Segment Desktop / Server
Intel Celeron SU2300 Name AMD EPYC 7343
Intel Celeron SU2000 Group AMD EPYC 7003
1 Generation 3
 
 

CPU Cores and Base Frequency

The Intel Celeron SU2300 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Celeron SU2300 is 1.2 GHz
The AMD EPYC 7343 has 16 CPU cores and can calculate 32 threads in parallel.
The clock frequency of the AMD EPYC 7343 is 3.2 GHz
and turbo frequency for one core is 3.9 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
normal Core architecture normal
2x Cores 16x Zen 3
No Hyperthreading Yes
1.2 GHz Frequency 3.2 GHz
No Overclocking No
2 Threads 32
None None 3.9 GHz
2 CPU Cores 16
 
 

Internal Graphics

The Intel Celeron SU2300 does not have integrated graphics.
The AMD EPYC 7343 does not have integrated graphics.
-- GPU (Turbo) --
-- Release date --
-- Execution units --
-- Direct X --
-- Max. displays --
-- Shaders --
GPU name
-- GPU frequency --
0 bytes Max. GPU Memory 0 bytes
-- Generation --
-- Technology --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP8 --
-- VP9 --
-- AVC --
-- h264 --
-- JPEG --
-- VC-1 --
-- AV1 --
-- h265 / HEVC (8 bit) --
-- h265 / HEVC (10 bit) --
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 4.0 TB distributed across 8 memory channels. It offers a peak memory bandwidth of 204.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
No AES-NI Yes
0 bytes Max. Memory 4.0 TB
-- Bandwidth 204.8 GB/s
Memory type DDR4-3200
pci PCIe pci
-- Memory channels 8
No ECC Yes
 
 

Thermal Management

The processor has a thermal design power (TDP) of 10 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 190 W watts.
None TDP down 165 W
None TDP up 200 W
10 W TDP (PL1 / PBP) 190 W
100 °C Tjunction max --
 
 

Technical details

The Intel Celeron SU2300 is manufactured using a 45 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The AMD EPYC 7343 is manufactured using a 7 nm process.
In total, this processor boasts a generous 128.0 MB cache.
Technical data sheet Documents Technical data sheet
Q3/2009 Release date Q1/2021
BGA 956 Socket SP3
1.0 MB L2-Cache 0 bytes
0 bytes L3-Cache 128.0 MB
Windows 10, Linux Operating systems Windows 10, Linux
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
-- Part Number --
Montevina (Penryn) Architecture Milan (Zen 3)
VT-x Virtualization AMD-V, SVM
-- Release price 1565 $
SSE3, MMX, SSSE3, SSE, SSE2 ISA extensions SSE4a, SSE4.1, SSE4.2, FMA3, AVX2
Monolithic Chip design Chiplet
45 nm Technology 7 nm