CPU comparison with benchmarks |
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CPU lineage |
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Intel Xeon D-1702 or Intel Xeon D-1702 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon D-1702 features 2 processor cores and has the capability to manage 4 threads concurrently. It was released in Q1/2022 and belongs to the 4 generation of the Intel Xeon D series. To use the Intel Xeon D-1702, you'll need a motherboard with a BGA 2227 socket. The AMD E2-3300M features 2 processor cores and has the capability to manage 2 threads concurrently. It was released in Q3/2011 and belongs to the 3 generation of the AMD E series. To use the AMD E2-3300M, you'll need a motherboard with a FS1 socket. |
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4 | Generation | 3 |
Intel Xeon D-1702 | Name | AMD E2-3300M |
Intel Xeon D | Family | AMD E |
Desktop / Server | Segment | Mobile |
Intel Xeon D-1700 | Group | AMD E2-3000 |
CPU Cores and Base Frequency |
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The Intel Xeon D-1702 has 2 CPU cores and can calculate 4 threads in parallel.
The clock frequency of the Intel Xeon D-1702 is 1.6 GHz and turbo frequency for one core is 1.7 GHz. The AMD E2-3300M has 2 CPU cores and can calculate 2 threads in parallel. The clock frequency of the AMD E2-3300M is 1.8 GHz and turbo frequency for one core is 2.2 GHz. |
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4 | Threads | 2 |
Yes | Hyperthreading | No |
1.7 GHz | Turbo Frequency (all cores) | 2.2 GHz |
1.6 GHz | Frequency | 1.8 GHz |
2 | CPU Cores | 2 |
normal | Core architecture | normal |
1.7 GHz | Turbo Frequency (1 core) | 2.2 GHz |
2x Sunny Cove | Cores | 2x |
No | Overclocking | Yes |
Internal Graphics |
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The Intel Xeon D-1702 does not have integrated graphics.
The AMD E2-3300M has integrated graphics, called iGPU for short. Specifically, the AMD E2-3300M uses the AMD Radeon HD 6480G, which has 240 texture shaders and 3 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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GPU name | AMD Radeon HD 6480G | |
-- | Shaders | 240 |
-- | Technology | 32 nm |
-- | GPU frequency | 0.44 GHz |
-- | Execution units | 3 |
-- | GPU (Turbo) | -- |
-- | Direct X | 11 |
-- | Generation | 3 |
0 bytes | Max. GPU Memory | 1.0 GB |
-- | Release date | Q2/2011 |
-- | Max. displays | -- |
Artificial Intelligence and Machine Learning |
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-- | AI hardware | -- |
-- | AI specifications | -- |
Hardware codec support |
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A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
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-- | JPEG | Decode / Encode |
-- | AV1 | No |
-- | VC-1 | Decode |
-- | h265 / HEVC (10 bit) | No |
-- | h265 / HEVC (8 bit) | No |
-- | h264 | Decode |
-- | VP8 | No |
-- | AVC | Decode |
-- | VP9 | No |
Memory & PCIe |
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The processor supports a maximum memory capacity of 256.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 38.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
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Yes | AES-NI | Yes |
Yes | ECC | No |
pci | PCIe | pci |
DDR4-2400 | Memory type | DDR3-1333 |
2 | Memory channels | 1 |
256.0 GB | Max. Memory | 0 bytes |
38.4 GB/s | Bandwidth | -- |
Thermal Management |
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The processor has a thermal design power (TDP) of 25 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself. The processor has a thermal design power (TDP) of 35 W watts. |
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-- | Tjunction max | -- |
25 W | TDP (PL1 / PBP) | 35 W |
Technical details |
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The Intel Xeon D-1702 is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The AMD E2-3300M is manufactured using a 28 nm process. In total, this processor boasts a generous 1.0 MB cache. |
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113 $ | Release price | -- |
10 nm | Technology | 28 nm |
x86-64 (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
Technical data sheet | Documents | Technical data sheet |
5.0 MB | L2-Cache | 0 bytes |
0 bytes | L3-Cache | 1.0 MB |
SSE4.1, SSE4.2, AVX2, AVX-512 | ISA extensions | SSE3, SSE4a |
VT-x, VT-x EPT, VT-d | Virtualization | AMD-V |
-- | Part Number | -- |
Monolithic | Chip design | -- |
BGA 2227 | Socket | FS1 |
Ice Lake | Architecture | Llano (K10) |
Q1/2022 | Release date | Q3/2011 |
Windows 10, Linux | Operating systems | |